Grinding plane positioning method of grinder
A technology of grinding plane and positioning method, which is applied to the parts of grinding machine tools, machine tools suitable for grinding workpiece planes, grinding machines, etc., which can solve the problems of insufficient grinding, uneven parallelism of the ground, and uneven grinding, and achieve improvement Grinding effect, the effect of ensuring the flatness of grinding
Active Publication Date: 2016-05-04
JINJIANG XINGYI POLISHING MACHINERY
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Problems solved by technology
[0002] Existing grinding machines have been widely used in polishing and grinding stone floors, cement floors and hard floors, but now the ground has different parallelism and some unevenness, and if there is a slope or angle slope at a certain angle, it will cause The grind is uneven and needs to be re-grinded
In addition, during the grinding process of the grinder, the abrasive of the grinding disc will be gradually consumed with the grinding time, which will lead to insufficient grinding and poor grinding effect
Method used
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Embodiment Construction
[0024] The present invention will be further described below with reference to the drawings and specific embodiments.
[0025] Such as Figure 1~2 As shown, a grinding plane positioning method of a grinding machine includes the following steps:
[0026] Step S0: Set more than one laser emitter on the peripheral side of the surface to be polished, the installation height of the laser emitter is H, and H is the level of the polished plane;
[0027] Step S1: Install a laser receiver on the grinder for receiving the laser light emitted by the laser transmitter, the height of the laser receiver is H1; the height of the laser receiver H1 changes with the height of the grinding plane ;
[0028] Step S3: More than one photoelectric sensor for measuring the abrasive loss in the grinding disc is evenly arranged on the grinding base of the grinder along the circumference; the initial thickness of the abrasive in the grinding disc is set to F, and the current thickness of the abrasive is F1;
[0...
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The invention relates to a grinding plane positioning method of a grinder. One or more laser emitters are arranged on the periphery of a to-be-ground face. The installation height of the laser emitters is H. A laser receiver is arranged on the grinder. The height of the laser receiver is H1. The height H1 of the laser receiver changes when the height of the grinding plane changes. One or more photoelectric sensors for measuring the consumption amount of a grinding material in a grinding disc are evenly distributed on the periphery of a grinding base of the grinder. The initial thickness of the grinding material in the grinding disc is set as F, and the current thickness of the grinding material is F1. In the fourth step, the laser emitters and the laser receiver are adjusted to the same horizontal plane, and grinding starts. The relative height Z of the grinding base is adjusted through a lifting drive mechanism, and therefore it is ensured that in the grinding process of the grinder, Z is equal to 0, wherein the equation Z=H-(F-F1)-H1 is true. The grinding plane positioning method has the advantages that the laser receiver, the laser emitters and the photoelectric sensors are used in cooperation for controlling the grinding height, and the consistency of grinding planarity is ensured.
Description
Technical field [0001] The invention relates to the field of grinding, in particular to a grinding machine with laser positioning and a control method thereof. Background technique [0002] Existing grinders have been widely used for polishing and polishing stone floors, cement floors, and hard floors. However, the parallelism of the ground is now different, there are some unevenness, and if there is a certain angle of slope or angle slope, it will cause The grinding is uneven and needs to be ground again. In addition, during the grinding process of the grinder, the abrasive of the grinding disc will gradually be consumed with the grinding time, which will result in improper grinding and poor grinding effect. Summary of the invention [0003] The purpose of the present invention is to solve the above shortcomings and provide a grinding plane positioning method of a grinder, which improves the grinding effect and ensures the uniformity of the grinding flatness. [0004] The solutio...
Claims
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IPC IPC(8): B24B7/18B24B41/00B24B49/12B24B49/02
CPCB24B7/186B24B41/00B24B49/02B24B49/12
Inventor 叶根翼
Owner JINJIANG XINGYI POLISHING MACHINERY