Rigid-flexible combined board and laminating method thereof

A rigid-flex combined board and board-substrate technology, which is applied in the structural connection of printed circuits, printed circuit components, electrical components, etc., can solve problems such as poor bonding force and rigid boards, and achieve the effect of pressure balance

Inactive Publication Date: 2016-06-08
深圳市仁创艺电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a rigid-flex board with good bonding force and less prone to defects in the subsequent rigid board to solve the problems of poor bonding force and defects in the subsequent rigid board when the flexible board is directly bonded to the surface of the rigid board by pressing. Bonding method of bonding board

Method used

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  • Rigid-flexible combined board and laminating method thereof
  • Rigid-flexible combined board and laminating method thereof
  • Rigid-flexible combined board and laminating method thereof

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] A pressing method for rigid-flex boards, comprising the steps of:

[0025] The flexible board, cover film, adhesive sheet, and rigid board substrate are stacked and riveted to form a riveted structure;

[0026] A release film and a steel plate are laminated on both sides of the riveting structure, and a hard silicone sheet is laminated between the release film and the steel plate on the side close to the rigid plate substrate to obtain a laminated structure;

[0027] A pressing operation is performed on the laminated structure.

[0028] Specifically, the material of the adhesive sheet is p...

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PUM

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Abstract

The invention relates to a laminating method of a rigid-flexible combined board. The laminating method comprises the following steps: stacking up a flexible plate, a cover film, an adhesive sheet and a rigid plate substrate and riveting to form a riveted structure; laminating release films and steel plates at two sides of the riveted structure respectively and laminating a hard silicon sheet between the release film and the steel plate, close to one side of the rigid plate substrate, to obtain a laminated structure; and pressing the laminated structure. According to the laminating method of the rigid-flexible combined board, during laminating, the hard silicon sheet is arranged at one side close to the rigid plate substrate, the purpose of pressure balance can be effectively realized, and the defects such as collapse due to unbalanced pressure, zigzag line, notch and the like can be overcome. The invention further provides a rigid-flexible combined board.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a pressing method of a rigid-flex board and a rigid-flex board. Background technique [0002] A rigid-flex board is a circuit board that combines a soft board and a hard board to form a single component. The rigid-flex board has changed the traditional planar design concept and expanded it to a three-dimensional three-dimensional space concept, which brings great convenience to product design. At the same time, the rigid-flex board has the characteristics of being bendable and foldable. Therefore, it can be used to make custom circuits to maximize the use of available space, thereby reducing the space occupied by the entire system. The application range of rigid-flex boards includes: aerospace, advanced medical equipment, digital cameras, and high-quality MP3 players and many other fields. [0003] At present, during the lamination process of rigid-flexible boards, when...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/36
CPCH05K3/365H05K1/147H05K2203/068
Inventor 姚国庆
Owner 深圳市仁创艺电子有限公司
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