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Front cooling lighting fixtures

A lighting fixture and heat dissipation technology, which is applied in the field of front-end heat dissipation lighting fixtures, can solve the problems of low heat conduction efficiency, slow heat dissipation speed, excessive heat load of the internal circuit mechanism of the lighting device, etc., and achieve good heat dissipation performance

Active Publication Date: 2018-07-03
东莞市闻誉实业有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The lighting device adopting the above-mentioned structure for heat dissipation has low heat conduction efficiency and slow heat dissipation speed, which makes the lighting device prone to safety hazards due to poor heat dissipation and excessive heat load of the internal circuit mechanism

Method used

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  • Front cooling lighting fixtures
  • Front cooling lighting fixtures
  • Front cooling lighting fixtures

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Embodiment Construction

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention provides an illuminating lamp capable of achieving heat dissipation at the front end. The illuminating lamp capable of achieving heat dissipation at the front end comprises a base, a circuit mechanism, a supporting frame, a lamp shade, a heat dissipation pipe and an LED module. The base comprises a base plate and an installation cover, and the installation cover is arranged on the base plate in a covering mode. The supporting frame is installed on the installation cover. The lamp shade end is connected with the supporting frame. A heat dissipation opening is formed in the second end of the lamp shade. The first end of the heat dissipation pipe is fixed to the first end of the lamp shade, the heat dissipation pipe is hollow, and the second end of the heat dissipation pipe communicates with the outside. A plurality of heat dissipation strips are arranged in a heat dissipation cavity. The two ends of each heat dissipation strip are both connected with the inner side of the heat dissipation pipe, and the heat dissipation pipes form a net-shaped structure. The LED module comprises a plurality of LED sub light sources, and the LED sub light sources are arranged on the outer side wall of the heat dissipation pipe. According to the illuminating lamp capable of achieving heat dissipation at the front end, the heat dissipation cavity communicating with the outside is formed in the heat dissipation pipe, and the heat dissipation opening is formed in the lamp shade so that heat generated by the LED sub light sources can be dissipated to the outside more rapidly and timely, and the heat dissipation performance is good.

Description

technical field [0001] The invention relates to the technical field of lighting heat dissipation, in particular to a front-end heat dissipation lighting fixture. Background technique [0002] At present, in existing lighting devices, the main heating elements are usually the PCB aluminum substrate directly in contact with the light source, and the circuit board that drives the light source to emit light. In order to integrate the illuminating device, usually the PCB aluminum substrate and the circuit board are placed inside the illuminating device. [0003] Generally, PCB aluminum substrates and circuit boards generally transfer heat to the air through the housing. The illuminating device adopting the above-mentioned structure for heat dissipation has low heat conduction efficiency and slow heat dissipation speed, which makes the illuminating device prone to potential safety hazards of excessive heat load of the internal circuit mechanism due to poor heat dissipation. Con...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S6/00F21V29/83F21V3/02F21V29/89F21V29/506F21Y115/10
CPCF21S6/00F21V3/02F21V29/506F21V29/83F21V29/89
Inventor 叶伟炳
Owner 东莞市闻誉实业有限公司
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