Substrate Holding Mechanism And Substrate Processing Apparatus Using The Same

Abstract

The invention provides a substrate holding mechanism and a substrate processing apparatus using the same. The substrate holding mechanism of holding a substrate in a predetermined substrate holding region on a susceptor, including: a substrate holding member installed around the substrate holding region and configured to be in contact with a lateral surface of the substrate mounted on the substrate holding region at a predetermined contact surface of the substrate holding member when the substrate holding member is rotated inward of the substrate holding region; a biasing part configured to apply a biasing force with respect to the substrate holding member such that the substrate holding member is brought into contact with the lateral surface of the substrate to hold the substrate; and a release member configured to apply a pressing force against the biasing force of the biasing part with respect to the substrate holding member such that the substrate holding member is released to vertically lift up the substrate.

Description

Technical field [0001] The present invention relates to a substrate holding mechanism and a substrate processing apparatus using the substrate holding mechanism. Background technique [0002] Conventionally, there has been known a first film forming apparatus in which a plurality of substrates are respectively placed on a plurality of recesses arranged in the circumferential direction of a rotating table provided in a vacuum vessel, and by rotating The table rotates, so that the substrate sequentially passes through the processing gas supply position, thereby forming a thin film on the substrate. In this first film forming apparatus, the following structure is known: in order to prevent the substrate from flying out of the turntable due to the pressure difference in the area through which the substrate passes, the peripheral edge of the substrate mounting area is formed into a ring along the circumferential direction of the substrate. The ring member in the shape of a ring is fi...

AI Technical Summary

Problems solved by technology

[0006] However, in the structure of the above-mentioned first film forming apparatus, the ring member covers a part of the peripheral portion of the surface of the substrate. Therefore, there is a problem that the film formation at the portion where the ring member is provided becomes insufficient, or the On the other hand, the supplied air flow changes due to the presence of the ring member, which adversely affects the overall film formation.

Images