Methods for texturing a chamber component and chamber components having a textured surface

Abstract

A method for a textured surface on a chamber component is provided and includes providing a chamber component, applying a Iayer of a photoresist to a surface of the chamber component, exposing a portion of the photoresist to optical energy using a m ask to cure a portion of the photoresist, removing uncured photoresist from the surface, and electrochemically etching the chamber component to form a textured surface on the chamber component.

Description

technical field [0001] Embodiments disclosed herein generally relate to methods for modifying the surface of a material. More specifically, embodiments disclosed herein relate to methods for modifying surfaces for components in process chambers and providing textured surfaces on chamber components. Background technique [0002] As the fabrication dimensions of integrated circuit devices continue to decrease, the manufacture of these devices is more susceptible to reduced yields due to contamination. Accordingly, the fabrication of integrated circuit devices, especially those devices having smaller physical dimensions, requires a greater degree of contamination control than was previously thought necessary. [0003] Contamination of integrated circuit devices may result from sources such as unwanted stray particles impinging on the substrate during thin film deposition, etching, or other semiconductor fabrication processes. Generally, the fabrication of integrated circuit d...

AI Technical Summary

Problems solved by technology

Contaminated devices often must be discarded, thereby reducing the manufacturing yield of the process

[0004] To avoid problems associated with dislodged species, chamber surfaces require frequent and sometimes time-consuming cleaning steps to remove deposited species from chamber surfaces

Also, no matter how many times cleaning is performed, contamination from dislodged material may still occur in some cases

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