Mask frame assembly, method for manufacturing same, and method for manufacturing organic light-emitting display device
A manufacturing method and mask technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of reduced dispersion, narrowed width of open slits, etc., to achieve the effect of improving adhesion
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[0032] The invention is capable of many modifications and embodiments, and it is intended that certain embodiments be shown in the drawings and described in detail. Effects and features of the present invention and methods of achieving them will become clear by referring to the embodiments described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be realized in various forms. In the following embodiments, terms such as "first" and "second" do not have limiting meanings, but are used for the purpose of distinguishing one constituent element from other constituent elements. In addition, expressions in the singular include expressions in the plural unless the context clearly indicates otherwise. In addition, words such as "comprising" or "having" refer to the existence of the features or constituent elements described in the specification, and do not exclude the possibility of adding...
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