An electronic chip packaging structure using ultrasonic welding
A technology of ultrasonic welding and electronic chips, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of limited service life, high price, weakened pressure-resistant structural strength, etc., and achieve high fluidity, good welding performance, high intensity effect
Inactive Publication Date: 2019-01-04
NO 719 RES INST CHINA SHIPBUILDING IND
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Problems solved by technology
The thread pair needs to turn an extremely large number of teeth in the processing process, and the sealing part needs an extremely long number of teeth in order to achieve the expected sealing effect. This design has the following disadvantages: it occupies a limited space and weakens the strength of the pressure-resistant structure At the same time, the thread fit is extremely easy to be corroded and invalidated in a severely corrosive liquid, and it is impossible to achieve sealing and pressure bearing in harsh environments
At the same time, usually the solution needs to be equipped with an anti-aging high-quality imported sealing ring in order to achieve sealing. The rubber sealing ring has a long cycle, is expensive, and has an extremely limited service life.
Method used
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[0023] The present invention will be described in detail below with reference to the accompanying drawings and examples.
[0024] as attached figure 1 As shown, the present invention provides an electronic chip packaging structure adopting ultrasonic welding, the packaging structure includes a cover plate 1 and a box body 2 made of polyetheretherketone material, and the peripheral equipment is an electronic chip; the cover plate 1 and the box body The material of body 2 is polyetheretherketone, the base material of polyetheretherketone is Victrex 450, the auxiliary materials are 20% glass fiber and 15% carbon fiber, and the sum of the two ratios is less than 45%; The temperature is kept at 390 degrees, and the pressure is kept at 30MPa.
[0025] The cover plate 1 has a circular structure, and a tapered ring with a triangular cross section is processed along the circumferential direction on its outer peripheral surface. The tapered ring is located at the center of the thicknes...
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The invention discloses an electronic chip packaging structure using ultrasonic welding. The packaging structure comprises a cover plate and a box body made of polyether ether ketone materials. The outer circumference of the cover plate is processed in the circumferential direction to form a conical ring with a triangular cross section. The vertex angle of the conical ring is an arc transition. The bottom surface of the cover plate is provided with an annular triangular section welding structure. The inner cavity of the box body is formed by two consecutive cylindrical cavities. The cavity diameter at the opening end of the box body is larger than the cavity diameter at the closed end, and the stage face between the two cylindrical cavities is processed in the circumferential direction to form an annular triangular section welding structure. The cover plate is fixed in the cavity of larger diameter at the opening end of the box body through ultrasonic welding while the electronic chip is packaged in the cavity of the box body with smaller diameter. For its reasonable welding structure, reliable packaging can be achieved to solve the problem facing long term packaging under complex working conditions such as high pressure, high temperature, and impact, vibration load, and acid-base environment.
Description
technical field [0001] The invention relates to a packaging structure, in particular to a packaging structure for storing electronic chips, and belongs to the technical field of ultrasonic welding. Background technique [0002] The national energy strategy proposes to focus on the development of marine oil and gas resources. my country's deep-sea oil and gas resource development equipment team has ushered in an unprecedented development opportunity. As an important member of the deep-sea oil and gas resource development equipment team, the oil pipeline and its auxiliary devices undertake the key task of oil and gas transportation. . A series of electronic components represented by electronic chips are responsible for the management and maintenance of the life cycle of downhole equipment and deep-sea exploration equipment. Electronic chips record various specifications and maintenance information of pipelines. Electronic chips must It is reliably installed on the correspondin...
Claims
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IPC IPC(8): H01L23/04H01L23/08
Inventor 张华王楠张绳阎毓杰刘雄
Owner NO 719 RES INST CHINA SHIPBUILDING IND