Five-pin IC structure

Abstract

The invention discloses a five-pin IC structure. The structure comprises a plastic-sealed body, an upper base island, a lower base island, three right pins and two left pins, wherein the upper base island and the lower base island are arranged in the plastic-sealed body in an up-down interval mode; the three right pins are transversely arranged at a right side of the plastic-sealed body; and the two left pins are transversely arranged at a left side of the plastic-sealed body. The two left pins are correspondingly connected to the upper base island and the lower base island respectively. The structure possesses five output terminals / input terminals, the number of the pins is small, an IC size is small too and an IC production demand of a single chip or dual chips can be satisfied.

Description

technical field [0001] The invention relates to the technical field of IC structures, in particular to a five-pin IC structure. Background technique [0002] Common IC structures in the prior art generally have 8 pins, 10 pins or even more, and these ICs have empty pins in most cases in actual use, resulting in waste of pin materials. figure 1 Shown is the common 8-pin IC structure in the prior art, the base island 2' is provided in the plastic package 1', the base island 2' is a single piece, and the number of pins 3' on both sides of the base island 2' is large , and the distance between the pin 3' and the base island 2' is set, resulting in relatively large length and width of the IC, requiring a larger installation space during use. [0003] At the same time, with the continuous development of electronic technology, the ICs currently used in various types of drive circuits are relatively complicated, and two chips need to be packaged. However, the base island 2' in the ...

AI Technical Summary

Problems solved by technology

[0002] Common IC structures in the prior art generally have 8 pins, 10 pins or even more, and these ICs will have empty pins in most cases in actual use, resulting in waste of pin materials

figure 1 Shown is the common 8-pin IC structure in the prior art, the base island 2' is provided in the plastic package 1', the base island 2' is a single piece, and the number of pins 3' on both sides of the base island 2' is large , and the distance between the pin 3' and the base island 2' is set, resulting in a relatively large length and width of the IC, which requires a larger installation space when used

[0003] At the same time, with the continuous development of electronic technology, the ICs currently used in various types of drive circuits are relatively complicated, and two chips need to be packaged. However, the base island 2' in the existing IC structure is a single chip, and the two chips must be combined during production. Each chip is packaged separately and then connected by external leads. The processing technology is complex and the defect rate is high, which cannot meet the production needs of new ICs.

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