A kind of preparation method of biodetection chip
A biological detection and chip technology, applied in the direction of measuring devices, instruments, scientific instruments, etc., can solve the problems of unfavorable chip-level detection system integration, affecting the accuracy of detection results, unfavorable sensor array measurement, etc., to achieve easy large-scale preparation, Ease of processing and improved sensitivity
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[0038] The preparation of biological detection chip comprises the following steps:
[0039] 1. Substrate layer:
[0040] The substrate material of the substrate layer 1 is glass, and the glass substrate is ultrasonically cleaned with acetone for 5 minutes and ethanol for 5 minutes, and the subsequent preparation starts after drying.
[0041] Second, the planar coil layer:
[0042] (1) Sputtering Ti with a thickness of 10nm and Cu with a thickness of 20nm on a 4-inch glass wafer as an electroplating seed layer on the substrate, wherein Ti is used to strengthen the adsorption force between Cu and glass, such as Figure 5 as shown in (a);
[0043] (2) Use AZ4620 photoresist to form a planar coil pattern on the substrate through the processes of leveling, exposure and development, and expose the electroplating seed layer. The thickness of the glue here is 12 μm, such as Figure 5 as shown in (b);
[0044] (3) Through the electroplating process, the wires of the planar coil 11 ...
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