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Short circuit bar structure, manufacturing method thereof and thin film transistor substrate

A technology of shorting bars and substrates, applied in circuits, semiconductor devices, electric solid devices, etc., can solve problems affecting panel quality, increasing panel frame thickness, large capital and manpower, etc.

Inactive Publication Date: 2017-05-24
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the introduction of the shorting bar structure will increase the bezel thickness of the panel, which is undesirable
Moreover, in order to ensure that the panel can be used, the short-circuit bar structure must be removed by trimming (for example, laser trimming) after the test. If the short-circuit bar structure is not cleaned, it will cause defects and affect the quality of the panel.
In addition, the whole trimming process also needs to invest a lot of money and manpower, which greatly increases the production cost

Method used

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  • Short circuit bar structure, manufacturing method thereof and thin film transistor substrate
  • Short circuit bar structure, manufacturing method thereof and thin film transistor substrate
  • Short circuit bar structure, manufacturing method thereof and thin film transistor substrate

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Embodiment Construction

[0033] Specific embodiments of the present disclosure will be described in detail below, and it should be noted that the embodiments described here are only for illustration, and are not intended to limit the present disclosure. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. It will be apparent, however, to one of ordinary skill in the art that these specific details need not be employed to practice the present disclosure. In other instances, well-known circuits, materials or methods have not been described in detail in order to avoid obscuring the present disclosure.

[0034] Throughout this specification, reference to "one embodiment," "an embodiment," "an example," or "an example" means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in the present disclosure. In at least one embodiment. Thus, appearances...

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Abstract

The invention provides a short circuit bar structure, a manufacturing method thereof and a TFT (thin film transistor). The short circuit bar structure comprises a testing line, a detecting probe contact portion and at least one PN junction structure, the detecting probe contact portion is connected with the testing line and used for contacting with a detecting probe, the PN junction structures are positioned between the testing line and at least one line to be tested, so that testing signals are unidirectionally conducted along the direction from the testing line to the lines to be tested.

Description

technical field [0001] The present disclosure relates to the field of display device detection, in particular to a short bar structure, a manufacturing method thereof, and a thin film transistor substrate. Background technique [0002] In the production process of display equipment, it is necessary to test the performance of the equipment at each production stage, so as to detect existing problems in time and ensure the quality of the panel. The detection probe contact method is a commonly used detection method in detection items that need to be loaded with signals. For example, in the panel testing (for example, cell test) of a thin film transistor liquid crystal display (TFT-LCD), the detection probe contact method is often used to load signals to the lead area on the panel. In this process, the detection probes are in one-to-one correspondence with the lead areas on the panel, and the probes are respectively pierced into the corresponding lead areas to form connections a...

Claims

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Application Information

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IPC IPC(8): G02F1/1362H01L27/12
CPCG02F1/136259G02F1/136254G02F1/136263H01L27/124H01L22/14H01L22/32
Inventor 王勇朱载荣郭宏雁于洋郑尧燮谢宗添蒋增杨汤存对吴怀亮
Owner BOE TECH GRP CO LTD