Preparation method of graphene heat conducting silica gel pad

A technology of thermally conductive silica gel and graphene, applied in graphene, heat exchange materials, chemical instruments and methods, etc., can solve the problems of low lateral thermal conductivity of thermally conductive silica gel pads, poor heat soaking effect, etc., and achieve heat soaking effect Good, enhanced heat soaking effect, high heat transfer efficiency

Active Publication Date: 2017-06-13
YAHAM OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing a graphene heat-conducting silica gel pad, aiming to solve the problems of the prior art heat-conducting silica gel pads with low lateral thermal conductivity and poor heat uniformity

Method used

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  • Preparation method of graphene heat conducting silica gel pad
  • Preparation method of graphene heat conducting silica gel pad
  • Preparation method of graphene heat conducting silica gel pad

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preparation example Construction

[0013] The present invention is achieved like this, a kind of preparation method of graphene heat-conducting silica gel pad, comprises the following steps:

[0014] S01. Provide a metal foil, and grow a single-layer graphene film on the surface of the metal foil by chemical vapor deposition to obtain a graphene film / metal foil;

[0015] S02. Prepare the thermally conductive filler modified by the coupling agent. Mix the thermally conductive filler modified by the coupling agent, vinyl silicone oil, hydrogen-containing silicone oil, inhibitor and catalyst to form a mixed material. Press the sheet to prepare a thermally conductive silica gel pad;

[0016] S03. The graphene surface of the graphene film / metal foil is attached to the thermal release tape, and the graphene film / metal foil is placed in an etching solution until the metal foil is completely dissolved to obtain graphite Graphene film / thermal release tape; After rinsing and drying the graphene film / thermal release tape...

Embodiment 1

[0043] A preparation method for a graphene thermally conductive silica gel pad, comprising the following steps:

[0044] S11. Growth of graphene film

[0045] Put the copper foil in a chemical vapor deposition furnace, feed methane and hydrogen at 1000°C and 0.1 Pa, the methane flow rate is 5 sccm, the hydrogen flow rate is 10 sccm, and grow for 5 minutes to obtain a copper foil with a graphene film.

[0046] S12. Preparation of thermally conductive silica gel pad

[0047] Mix a 1:1 mixture of 100g of aluminum oxide and graphene powder with 300g of ethanol, add 1g of deionized water, 1g of γ-aminopropyltriethoxysilane, and stir Add 0.1g of hydrochloric acid, continue to stir for 4 hours at a speed of 300rpm, filter and wash with water, then add 200g of deionized water, and spray dry to obtain a thermally conductive filler modified by a coupling agent; mix 100g of vinyl silicone oil, 1g of hydrogen-containing Silicone oil, 300g of thermally conductive filler modified by coupl...

Embodiment 2

[0051] A preparation method for a graphene thermally conductive silica gel pad, comprising the following steps:

[0052] S21. Growth of graphene film

[0053] Put the copper foil in a chemical vapor deposition furnace, feed methane and hydrogen at 1000°C and 0.1Pa, the methane flow rate is 5 sccm, the hydrogen flow rate is 10 sccm, and grow for 5 minutes to obtain a copper foil with a graphene film.

[0054] S22. Preparation of thermally conductive silicone pad

[0055] Mix a 1:1 mixture of 100g of aluminum oxide and graphene powder with 300g of ethanol, add 1g of deionized water, 1g of γ-aminopropyltriethoxysilane, and stir Add 0.1g of hydrochloric acid, continue to stir for 4 hours at a speed of 300rpm, filter and wash with water, then add 200g of deionized water, and spray dry to obtain a thermally conductive filler modified by a coupling agent; mix 100g of vinyl silicone oil, 1g of hydrogen-containing Silicone oil, 300g of thermally conductive filler modified by coupling...

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Abstract

The invention provides a preparation method of a graphene heat conducting silica gel pad. The preparation method comprises the following steps: growing a single-layer graphene thin film on the surface of a metal foil piece by adopting a chemical vapour deposition method, so that a graphene thin film/metal foil piece is obtained; preparing coupling agent modified heat conducting filler, mixing the coupling agent modified heat conducting filler, vinyl silicone oil, hydrogen-containing silicone oil, an inhibitor and a catalyst to form mixed materials, carrying out rolling treatment, and then tabletting under heating condition, so that a heat conducting silica gel pad is obtained; fitting the graphene surface of the graphene thin film/metal foil piece with a heat release adhesive tape, carrying out surface polishing on a metal foil piece surface of the graphene thin film/metal foil piece, and then putting in etching liquor until the metal foil piece is completely dissolved, so that a graphene thin film/heat release adhesive tape is obtained; and rinsing the graphene thin film/heat release adhesive tape with deionized water, drying, then fitting the surface, pasted with the graphene thin film, of the graphene thin film/heat release adhesive tape, and then removing the heat release adhesive tape.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, in particular to a method for preparing a graphene heat-conducting silica gel pad. Background technique [0002] With the continuous integration of electronic devices, more and more powerful functions are integrated into smaller components to achieve multifunctional components. However, in the operation of highly integrated equipment, due to the rapid increase in temperature, it is easy to slow down the operation speed of the equipment, the device fails in the middle of work, the size and space are limited, and many other performance problems. Therefore, temperature control has become one of the crucial challenges in the design, that is, how to effectively take away more heat generated by a larger unit of power under the condition of compact structure and smaller and smaller operating space, which is a highly integrated device One of the key points of the design. Thermally con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/06C08K9/06C08K9/04C08K3/22C08K3/04C08K5/05C08K5/5425C08K3/08C08K5/50C08K3/38C09K5/14C01B32/186
CPCC08L83/04C08L2203/20C08L2205/025C09K5/14C08K13/06C08K9/06C08K2003/2227C08K3/04C08K5/05C08K5/5425C08K3/08C08K2003/2296C08K5/02C08K2003/385C08K2003/085C08K2003/0812C08K5/50C08K9/04
Inventor 叶恩洲林菊香黄裔裔焦伟棋张新庆陈文冰
Owner YAHAM OPTOELECTRONICS CO LTD
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