Heat conduction test device for material contact interface in vacuum environment and test method thereof
A technology of contact interface and vacuum environment, applied in the direction of material thermal conductivity, material thermal development, etc., can solve the problem of less thermal data
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0029] Such as figure 1 , figure 2 Shown is a preferred embodiment of the material contact interface thermal conductivity test device in a vacuum environment provided by the present invention, which includes:
[0030] The outer cavity 2 is supported by universal wheels 1 below it to make it easy to move, and its side is provided with a vacuum port 6 and a vacuum test port 7;
[0031] The inner cavity 3 is closed, it is placed in the outer cavity 2, and there is an interlayer between the outer cavity 2, the inner cavity 3 is connected with a liquid feeding pipe 23 and a discharge pipe 22 for internal The cavity 3 is filled with low-temperature liquid; the upper surface of the inner cavity 3 is also recessed downward to form a groove 8, and the liquid level of the low-temperature liquid should be at least higher than the bottom of the groove 8; the groove 8 is recessed into the inner cavity 3 inside, so that the stainless steel plate at the bottom of the groove 8 can be compl...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 

