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Asymmetrically structured PCB stitching technology

An asymmetric and crafted technology, applied in the field of PCB manufacturing, can solve the problems of over-limited bending of the laminated PCB and different thicknesses of upper and lower PP sheets, and achieve the effect of alleviating the degree of bending and balancing internal stress

Pending Publication Date: 2017-08-11
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: to solve the problem that the thickness of the upper and lower layers of PP sheets is inconsistent, which leads to the problem that the bending of the board exceeds the limit when pressing the PCB.

Method used

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  • Asymmetrically structured PCB stitching technology
  • Asymmetrically structured PCB stitching technology
  • Asymmetrically structured PCB stitching technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The positioning holes added in step S1 are marked with two groups, which are respectively located on two adjacent sides of the film.

[0039] Setting two sets of positioning hole marks is beneficial to improve the accuracy.

Embodiment 2

[0041] The diameter of the positioning hole is 1.5 mm.

Embodiment 3

[0043] The groove processing in step S3 is to form grooves on the periphery of the long and short sides of the core board and between the SETs.

[0044] By forming grooves on the periphery of the core board and between the SET, the large core board is divided into multiple small areas, which is conducive to the release of internal stress, and the upper and lower layers of resin are partially connected through the forming grooves, which is conducive to balancing the internal stress of the upper and lower layers.

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Abstract

The invention belongs to the PCB manufacturing field and provides an asymmetrically structured PCB stitching technology. According to the invention, through the gong slot treatment to an inner layer core, the inner layer core is divided into a plurality of small areas, which facilitates the balance of the inner stress between the PP sheets of the upper layer and the lower layer and eases the bending degree of an asymmetrically structured PCB.

Description

technical field [0001] The invention relates to the field of PCB manufacturing, in particular to a PCB pressing process with an asymmetric structure. Background technique [0002] PCB (short for Printed Circuit Board) is also known as printed circuit board. PCB has developed from single layer to double-sided board, multi-layer board and flexible board, and is constantly developing in the direction of high precision, high density and high reliability. Multi-layer PCBs are generally laminated and bonded together by prepreg (PP sheet, polypropylene material) adhesive layers between adjacent circuit layers. Specifically, the entire PP sheet is stacked between adjacent layers, and then heated through Pressing makes the adjacent circuit layers bond together through the PP sheet. [0003] In the conventional design of multi-layer circuit boards, the PP sheets between the circuit layers are all the same thickness. Taking a 4-layer board as an example, two PP sheets are used for lam...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4611H05K2203/068
Inventor 张华勇敖四超钟宇玲寻瑞平
Owner JIANGMEN SUNTAK CIRCUIT TECH