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Method for polishing polishing pad

A technique for grinding pads and grinding discs, which is applied in the field of grinding-grinding pads, and can solve problems such as unsatisfactory

Inactive Publication Date: 2017-08-29
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the current grinding pad and the method for adjusting the grinding pad have met the general purpose, they do not satisfy all aspects.

Method used

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  • Method for polishing polishing pad
  • Method for polishing polishing pad
  • Method for polishing polishing pad

Examples

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Embodiment Construction

[0042] The following description provides many different embodiments or examples for implementing different features of the present disclosure. The elements and arrangements described in the following specific examples are only used to express the present disclosure in a concise manner, which are only examples and are not intended to limit the present disclosure. For example, a description of a first feature on or over a second feature includes direct contact between the first and second features, or another feature disposed between the first and second features such that the second feature The first and second features are not in direct contact. In addition, the present disclosure continues to use the same component numbers and / or words in different examples. The aforementioned repetition is only for simplification and clarity, and does not mean that different embodiments and settings must be related.

[0043] Furthermore, spatially related words such as below, below, lower...

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Abstract

A method for polishing a polishing pad includes detecting, by a first sensor, a presence of a defect formed on a groove of a polishing pad; removing, by a polishing disc, the defect from the groove of the polishing pad; after removing the defect, measuring, by a second sensor, a remaining depth of the groove; and based on the measured remaining depth of the groove, applying, through the polishing disc, a polishing condition on the groove.

Description

technical field [0001] The disclosure mainly relates to a polishing method, especially a method for polishing a polishing pad. Background technique [0002] During semiconductor manufacturing, a substrate may be polished or planarized to remove a layer or portion of the substrate, a known process known as chemical mechanical polishing (CMP). In a typical CMP process, the substrate is supported by an apparatus that presses the substrate onto a polishing pad (eg, a rotating pad). Usually, the above-mentioned polishing pads use polishing slurry, water or other liquids to polish the substrate. During the polishing process, the properties of the polishing pad can be changed, for example, changing the polishing rate or quality (eg, uniformity). Accordingly, polishing pad conditioning may be performed to restore the polishing pad by conditioning the surface of the polishing pad that contacts the substrate during polishing. Although the current polishing pads and methods for adju...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D11/00
CPCB24D11/001B24B49/12B24B53/017B24B37/26B24B37/005
Inventor 锺泽良萧伟镇戴钧凯孙旭昌
Owner TAIWAN SEMICON MFG CO LTD