Manufacturing method for quick-cooling computer case

Abstract

The invention discloses a manufacturing method for a quick-cooling computer case. The method comprises the following steps of 1, welding a case body; 2, arranging baffles; 3, digging the case body; 4, arranging a circulating pipe; 5, arranging a condensing bag; 6, filling the condensing bag with a condensing liquid; 7, folding the condensing bag; 8, mounting a mainboard; 9, electrically connecting the baffles with the mainboard, and mounting fans, blowing air to the mainboard, on the baffles on two sides of the mainboard; and 10, casting a cover fastened to the top end of the case body through a metal plate, and fastening the cover to the top end of the case body, thereby finishing the manufacturing of the quick-cooling computer case. The quick-cooling computer case manufactured with the method is good in cooling effect.

Description

technical field [0001] The invention relates to the field of computers, in particular to a method for manufacturing a fast heat dissipation computer case. Background technique [0002] Computer is an indispensable tool for people's work and life. The computer case is a key component of the computer. Like most electrical equipment, the cooling problem of the computer case is an important factor related to the speed of the computer. [0003] The existing computer case includes a casing and a cover. The box body is generally a cuboid with side openings. All physical components in the box are generally called computer hardware, including hard disks, CPUs, memory sticks, discrete graphics cards, optical drives and light sources, and various fans. The motherboard is the installation carrier of the above-mentioned electronic components, and other components are also connected to the motherboard through wires. And heat-generating devices with large heat, such as hard disks, CPU...

AI Technical Summary

Problems solved by technology

And one space can only install one kind of computer hardware. When some space is not used, it can only be idle there, which greatly wastes the space in the box and makes the space utilization rate in the box very low.

Moreover, because a plurality of space positions and external interfaces connected with these space positions are preset inside the box body, only a specific motherboard can be installed in a specific computer case, and the versatility of the computer case is relatively poor.

[0006] In view of the poor heat dissipation effect of the current computer case, it is urgent to develop a fast heat dissipation computer case with good heat dissipation effect and good versatility.

Images