Device for mounting polishing pad
A polishing pad and mounting surface technology, which is applied to devices for fixing grinding wheels, grinding/polishing equipment, and parts of grinding machine tools, etc. First-class problems, to achieve the effect of improving the process effect
Inactive Publication Date: 2017-09-05
HWATSING TECH +1
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- Description
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- Application Information
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Problems solved by technology
Due to the large diameter of the chassis and the different sizes of the polishing pads, it is impossible to guarantee the concentric arrangement of the polishing pad and the chassis, and the contact surface between the polishing pad and the chassis is prone to air bubbles during the installation process, which affects the process effect
Method used
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Embodiment Construction
[0021] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0022] Refer below Figure 1-3 An apparatus 100 for installing a polishing pad according to an embodiment of the present invention is described.
[0023] Specifically, the device 100 for installing a polishing pad may include: a chassis 10 and at least two adjustment and positioning devices 20 . Such as figure 1 combine figure 2 As shown, chassis 10 has a mounting surface 11 for mounting a polishing pad.
[0024] At least two adjustment and positioning devices 20 are installed on the side wall of the chassis 10 and located on the sa...
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The invention discloses a device for mounting a polishing pad. The device comprises a base plate and at least two adjustment locating devices, wherein the adjustment locating devices are mounted on the side wall of the base plate and are located on the same circumferential surface; the adjustment locating devices comprise sliding table assemblies; the sliding table assemblies can move relative to the radial direction of the base plate; and by adjustment of positions of the sliding table assemblies relative to the base plate, a mounting region of the polishing pad is defined, so that the polishing pad is concentrically arranged on the mounting surface of the base plate. According to the device for mounting the polishing pad, which is disclosed by the embodiment of the invention, the at least two adjustment locating devices are arranged on the side wall of the base plate; by the adjustment of the positions of the sliding table assemblies relative to the base plate, the mounting region of the polishing pad is defined, so that the polishing pad is concentrically arranged on the mounting surface of the base plate; and therefore, the technical effect of wafer polishing is enhanced.
Description
technical field [0001] The invention belongs to the technical field of semiconductors, in particular to a device for installing a polishing pad. Background technique [0002] Before the wafer is polished, the polishing pad first needs to be installed on the chassis, usually by manually placing the polishing pad horizontally on the chassis, and then tearing off the plastic protective layer on the polishing pad. Due to the large diameter of the chassis and the different sizes of the polishing pads, the concentric arrangement of the polishing pad and the chassis cannot be guaranteed, and air bubbles are likely to occur on the contact surface between the polishing pad and the chassis during the installation process, which affects the process effect. Contents of the invention [0003] The present invention aims to solve one of the above-mentioned technical problems at least to a certain extent. [0004] For this reason, the present invention proposes a device for installing a ...
Claims
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IPC IPC(8): B24B45/00
CPCB24B45/00
Inventor 马海港张敬业李海涛肖月朝路新春沈攀
Owner HWATSING TECH