Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Array substrate and preparation method thereof

A technology of an array substrate and a manufacturing method, applied in the field of display panels, can solve the problems of poor alignment film flatness, poor display effect, disconnection of metal layers or conductive layers, etc., so as to improve surface flatness, prevent corrosion, and reduce production costs Effect

Active Publication Date: 2017-09-15
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
View PDF5 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides an array substrate and a manufacturing method thereof, which can solve the problem of disconnection of the metal layer or the conductive layer caused by the poor flatness of the alignment film caused by the third metal layer and the large slope of the via hole.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Array substrate and preparation method thereof
  • Array substrate and preparation method thereof
  • Array substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0042] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0043] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0044] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an array substrate and a preparation method thereof. The array substrate comprises an underlay substrate, a thin film transistor layer located at one side of the underlay substrate, a flattening layer and a third metal layer. The thin film transistor layer comprises a gate metal layer, a first insulation layer, an active layer and a source and drain metal layer which are arranged in sequence. The gate metal layer and the source and drain metal layer are arranged at the side of the flattening layer close to the underlay substrate. The third metal layer is arranged at the side of the flattening layer away from the underlay substrate. A groove is arranged on the flattening layer at a position corresponding to the third metal layer. The third metal layer is formed in the groove. According to the array substrate and the preparation method thereof provided by the invention, the third metal layer is arranged in the groove on the flattening layer, the section difference between the position of the third metal layer on a rubbing film layer and other position is reduced or eliminated, the surface flatness of rubbing film is improved, the uniformity of the rubbing is improved, and the final display effect is optimized.

Description

technical field [0001] The present invention relates to the technical field of display panels, and more particularly, to an array substrate and a manufacturing method thereof. Background technique [0002] Prior art array substrates such as figure 1 As shown, the array substrate is sequentially arranged from bottom to top: a base substrate 101, a thin film transistor layer located on one side of the base substrate, a planarization layer 102, a third metal layer 103, a via hole 104, a film layer 105 and an alignment Film 106. The third metal layer 103 is directly laid on the side of the planarization layer away from the thin film transistor layer, and a film layer 105 is laid on the planarization layer and the third metal layer. The film layer 105 may include: a pixel electrode layer, a common electrode layer and each The insulating layer between the film layers; because there is a step difference between the third metal layer 103 and other positions, when the alignment fil...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/84
CPCH01L27/1244H01L27/1288
Inventor 许传志谢正芳汪梅林
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com