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OCA optical cement die cutting technology

An optical adhesive and die-cutting technology, applied in metal processing, chemical instruments and methods, lamination devices, etc., can solve the problems of bubble overflow, scrapping of the entire OCA, uneven laying, etc., to reduce the problem of edge overflow, Stable antistatic properties and the effect of protecting the OCA layer

Active Publication Date: 2017-12-01
昆山威斯泰电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the production process of OCA optical glue, there are bubble overflow problems, and the phenomenon of glue pulling in die-cutting will lead to the scrapping of the entire OCA
If there is uneven laying during the film change process, it will have a great impact on its light transmittance and overall quality

Method used

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  • OCA optical cement die cutting technology
  • OCA optical cement die cutting technology
  • OCA optical cement die cutting technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0026] refer to Figure 1-3 As shown, the present embodiment is an OCA optical adhesive die-cutting process, which includes the following steps: S1. The die-cutting operation environment of OCA optical adhesive directly affects the product quality of roller knife die-cutting. The operating environment is a thousand-class clean room, and the temperature is controlled at 24-26°C, humidity 80-90%, the relative static electricity is reduced, and the dust particles in the air are reduced on the product.

[0027] S2, slitting raw materials, OCA is a double-sided adhesive without substrate, with high fluidity, and heavy pressure should be avoided. When slitting raw materials, use a dust-free cloth dipped in alcohol to moisten and remove dust on the edge of the slitting knife, and then cut the raw material into small coils to avoid edge lint. Hang the cut material on the material rack.

[0028] S3, change the film, OCA optical adhesive itself has a heavy release film 1 on the lower ...

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Abstract

The invention discloses an OCA optical cement die cutting technology. The OCA optical cement die cutting technology comprises the following steps that die cutting operation is conducted in a thousand-level dust-free room of 80-90 % humidity; after a cutting knife is dedusted, the cutting knife cuts raw materials into small rolls to be hung on a material frame; an upper layer light release film self-contained by OCA optical cement is torn, and an OCA layer is exposed; after anti-sticking processing is conducted on a rolling cutter, the rolling cutter cuts to the two sides of the OCA layer, and a reserved part is formed between a cutting line and the edge of the rolling cutter; after a mylar layer is pasted on the reserved part, and the reserved part and the mylar layer are torn together; an anti-static film is attached to the surface of the OCA layer through a rubber covered roller, and rubber covered roller foam is circumferentially attached to the two sides of the rubber covered roller; the anti-static film is cut off by a punching cutter, and the outer frame edge of a product is greater than the edge of the OCA layer; and cutting is conducted every time the punching cutter rotates one revolution, and neatly-collecting-stacking is conducted. According to the OCA optical cement die cutting technology, the effects that the product has no cement pulling and cement overflowing are achieved.

Description

technical field [0001] The invention belongs to the technical field of OCA optical glue preparation, in particular to an OCA optical glue die-cutting process. Background technique [0002] OCA optical adhesive is one of the important raw materials for touch screens. Making optical acrylic adhesive into non-substrate tape is a better adhesive for touch screens. It has high clarity, high light transmittance, and the total light transmittance is greater than 90%. It also has the advantages of high adhesion, high temperature resistance, and UV resistance. In the production process of OCA optical glue, there will be problems of bubble overflow and glue pulling in die-cutting, which will lead to the scrapping of the entire OCA. If there is uneven laying during the film change process, it will have a great impact on its light transmission and overall quality. Contents of the invention [0003] The purpose of the present invention is to solve the above-mentioned technical proble...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D1/15B26D7/08B32B37/12B32B38/00
CPCB26D1/151B26D7/088B32B37/12B32B38/00B32B2038/006
Inventor 余代有高雁史科学
Owner 昆山威斯泰电子技术有限公司
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