Jet flow assisted laser plasma wafer cutting device and method

Abstract

The invention discloses a jet flow assisted laser plasma wafer cutting device and method. The jet flow assisted laser plasma wafer cutting device comprises a femtosecond laser, a jet flow assisting system, a CCD image system, a focusing lens set, a beam splitting lens, a rotary device, an optical shutter, a third harmonic generation device, a machining platform and a control system; the control system controls the femtosecond laser to generate laser, the laser is divided into two beams through the beam splitting lens, and the two beams of laser pass through the optical shutter separately or sequentially pass through the optical shutter and the third harmonic generation device and then enter the focusing lens set; a wafer is fixedly installed on the machining platform, the CCD image system is used for obtaining the position and state information of the wafer (13) and feeding the information back to the control system, and the control system controls the machining platform to move the wafer to the predetermined position; and the control system controls the rotary device to adjust the direction of jet flow sprayed by the jet flow assisting system to the laser focusing point of the focusing lens set, so that jet flow sprayed by the jet flow assisting system and laser of the focusing lens set are injected to the initial machining position of the wafer.

Description

technical field [0001] The invention belongs to the field of chip processing, and in particular relates to a jet-assisted laser plasma cutting device and method for chips, wafers, etc., in particular to a device and method for directional cutting by using jet-assisted femtosecond laser to generate plasma. Background technique [0002] Different types of wafers are used to manufacture different types of chips, such as silicon wafers, sapphire wafers, GaP wafers, InP wafers, GaN wafers, Ge wafers, etc. Different substrates require different cutting techniques. Chips with different structures also have special requirements when cutting. For example, when cutting 3D structure chips and MEMS chips, care must be taken not to damage the functional structure of the chip, and the cutting process is required to be stable and the stress is small. There are generally three stacking methods of 3D stacked chips: "wafer-wafer", "wafer-chip" and "chip-chip". No matter which method is used, ...

AI Technical Summary

Problems solved by technology

The composite processing of laser and water jet is also a way to solve the thermal effect of laser processing. However, due to the existence of water jet, it is easy to damage the functional structure of the chip when processing MEMS structure chips, and cannot adapt to the cutting process of this type of chip.

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