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Wafer cutting device and method for jet assisted laser plasma

A plasma and auxiliary laser technology is applied in the field of ion cutting device and ion plasma directional cutting device, which can solve the problems of easily destroying the functional structure of the chip and being unable to adapt to the chip cutting process, so as to improve economic benefits, reduce thermal effects, and simplify The effect of the process flow

Active Publication Date: 2019-03-19
WUHAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The composite processing of laser and water jet is also a way to solve the thermal effect of laser processing. However, due to the existence of water jet, it is easy to damage the functional structure of the chip when processing MEMS structure chips, and cannot adapt to the cutting process of this type of chip.

Method used

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  • Wafer cutting device and method for jet assisted laser plasma
  • Wafer cutting device and method for jet assisted laser plasma
  • Wafer cutting device and method for jet assisted laser plasma

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Embodiment Construction

[0047] In order to facilitate those of ordinary skill in the art to understand and implement the present invention, the present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the implementation examples described here are only used to illustrate and explain the present invention, and are not intended to limit this invention.

[0048] please see figure 1 and figure 2 A jet-assisted laser plasma wafer cutting device provided by the present invention includes a femtosecond laser 1, a jet-assisted system 2, a CCD imaging system 3, a focusing lens group 4, a beam splitting lens 5, a rotating device 6, and a shutter 7 , Triple frequency device 8, processing platform and control system; the rotating device 6 has two degrees of freedom, installed on the nozzle in the jet auxiliary system 2, and completes the adjustment of the jet direction under the control of the control system; the pro...

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Abstract

The invention discloses a jet flow assisted laser plasma wafer cutting device and method. The jet flow assisted laser plasma wafer cutting device comprises a femtosecond laser, a jet flow assisting system, a CCD image system, a focusing lens set, a beam splitting lens, a rotary device, an optical shutter, a third harmonic generation device, a machining platform and a control system; the control system controls the femtosecond laser to generate laser, the laser is divided into two beams through the beam splitting lens, and the two beams of laser pass through the optical shutter separately or sequentially pass through the optical shutter and the third harmonic generation device and then enter the focusing lens set; a wafer is fixedly installed on the machining platform, the CCD image system is used for obtaining the position and state information of the wafer (13) and feeding the information back to the control system, and the control system controls the machining platform to move the wafer to the predetermined position; and the control system controls the rotary device to adjust the direction of jet flow sprayed by the jet flow assisting system to the laser focusing point of the focusing lens set, so that jet flow sprayed by the jet flow assisting system and laser of the focusing lens set are injected to the initial machining position of the wafer.

Description

technical field [0001] The invention belongs to the field of chip processing, and in particular relates to a jet-assisted laser plasma cutting device and method for chips, wafers, etc., in particular to a device and method for directional cutting by using jet-assisted femtosecond laser to generate plasma. Background technique [0002] Different types of wafers are used to manufacture different types of chips, such as silicon wafers, sapphire wafers, GaP wafers, InP wafers, GaN wafers, Ge wafers, etc. Different substrates require different cutting techniques. Chips with different structures also have special requirements when cutting. For example, when cutting 3D structure chips and MEMS chips, care must be taken not to damage the functional structure of the chip, and the cutting process is required to be stable and the stress is small. There are generally three stacking methods of 3D stacked chips: "wafer-wafer", "wafer-chip" and "chip-chip". No matter which method is used, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304B23K26/38B23K26/70B23K101/40
CPCB23K26/38B23K26/70B23K26/702B23K2101/40H01L21/304
Inventor 刘胜王春喜占必红程佳瑞苏丹
Owner WUHAN UNIV
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