Substrate handling and heating system

Abstract

A substrate processing and heating system. A system for heating a substrate as the substrate is transferred between a load lock chamber and a stage is disclosed. The system includes an array of light emitting diodes disposed above an alignment station. The light emitting diodes may be GaN or GaP light emitting diodes, which emit light with wavelengths that are easily absorbed by silicon, thus heating the substrate efficiently and quickly. The light emitting diodes may be arranged such that rotation of the substrate during alignment produces a uniform temperature distribution of the substrate. Additionally, heating during alignment can also increase productivity and eliminate the need for preheating stations currently associated with process chambers.

Description

technical field [0001] Embodiments of the present disclosure relate to a system for heating a substrate, and more particularly, to a substrate processing and heating system for heating a substrate while aligning the substrate before processing. Background technique [0002] The manufacture of semiconductor components involves several separate and complex processes. During manufacture, semiconductor substrates typically undergo a number of processes. These processes may take place in process chambers, which may be maintained in a different process state than the environment. For example, the processing chamber can be maintained under vacuum. In some embodiments, a load lock is used to isolate the processing chamber from the external environment. One or more substrate processing robots are disposed in the processing chamber and move the substrate from the load lock to the platform on which the substrate is disposed during processing. [0003] The processing chamber may als...

AI Technical Summary

Problems solved by technology

As mentioned above, these preheating stations consume useful space and also increase the processing time for each substrate, thus reducing productivity

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