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Transferring method, manufacturing method, device and electronic apparatus of micro-led

一种微发光二极管、衬底转移的技术，应用在半导体/固态器件制造、电路、电气元件等方向，能够解决微发光二极管性能劣化、微发光二极管热预算限制等问题

Active Publication Date: 2018-04-06
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, the thermal budget of micro-LEDs for phase change is limited during fabrication using transfer head arrays, typically less than 350°C, or more specifically, less than 200°C; otherwise, the performance of the micro-LEDs would degrade

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  • Transferring method, manufacturing method, device and electronic apparatus of micro-led
  • Transferring method, manufacturing method, device and electronic apparatus of micro-led
  • Transferring method, manufacturing method, device and electronic apparatus of micro-led

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Embodiment Construction

[0038] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0039] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0040] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0041] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED (402) are disclosed. The method for transferring micro-LED (402) comprises: transferring at least one micro-LED (402) from an original substrate (406) to a support body (412); transferring the at least one micro-LED (402) from the support body (412) to a backup substrate (415); and transferring the atleast one micro-LED (402) from the backup substrate (415) to a receiving substrate (417).

Description

technical field [0001] The present invention relates to micro light emitting diodes for display, more particularly, to a method for transferring micro light emitting diodes, a method for manufacturing micro light emitting diode devices, a micro light emitting diode device and a micro light emitting diode device comprising Electronic equipment for light-emitting diode devices. Background technique [0002] Micro light-emitting diode (Micro LED) technology refers to a micro-sized LED array integrated with high density on a substrate. At present, micro-LED technology is beginning to develop, and the industry is expecting high-quality micro-LED products to enter the market. High-quality micro-LED products will have a profound impact on traditional display products such as LCD / OLED already on the market. [0003] In the process of manufacturing micro-light emitting diodes, micro-light-emitting diodes are first formed on a donor wafer, and then micro-light-emitting diodes are tr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
CPCH01L21/67144H01L21/6835H01L25/0753H01L33/0093H01L2221/68322H01L2221/68354H01L2224/16227H01L2224/81005H01L2224/95H01L2924/15313H01L2933/0033H01L24/00H01L33/38H01L33/44H01L33/52H01L33/62H01L2221/68368H01L2221/68381H01L2933/0016H01L2933/0025H01L2933/005H01L2933/0066
Inventor 邹泉波王喆
Owner GOERTEK INC