Glue dipping alignment device of equipment
A technology for aligning devices and devices, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of low overall efficiency and high processing costs, improve production efficiency, reduce processing and use costs, and shorten processing time. Effect
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[0027] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is only a part of the embodiments of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0028] figure 1 The overall structure diagram of the chip dipping glue part of the glue dipping alignment device according to an embodiment of the present invention is shown. The present invention provides a glue dipping alignment device. As shown in the figure, the chip dipping glue part includes a glue box 101, a glue squeegee ...
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