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Glue dipping alignment device of equipment

A technology for aligning devices and devices, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of low overall efficiency and high processing costs, improve production efficiency, reduce processing and use costs, and shorten processing time. Effect

Inactive Publication Date: 2018-04-20
唐人制造嘉善有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The glue dipping alignment device provided by the present invention can solve the problems of high processing cost and low overall efficiency of the existing glue dipping alignment device in view of the deficiencies of the prior art

Method used

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  • Glue dipping alignment device of equipment
  • Glue dipping alignment device of equipment
  • Glue dipping alignment device of equipment

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Embodiment Construction

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] figure 1 It shows the overall structure diagram of the chip dipping glue part of the glue dipping alignment device according to one embodiment of the present invention. The present invention provides a glue dipping alignment device. As shown in the figure, the glue dipping part of the chip includes a glue box 101 , a squeegee 102 , a ...

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Abstract

The invention provides a glue dipping alignment device of equipment. The glue dipping alignment device comprises a plastic box, a glue stripping plate, a sliding device and a camera, wherein the plastic box is used for placing glue and is not provided with a bottom surface, the glue stripping plate is used for bearing the equipment and forming a glue film on a surface of the equipment, a hole anda regional bottom plate are arranged at one end of the glue stripping plate, the regional bottom plate is formed by embedding the glue film into the hole, the surface height after the regional bottomplate is formed by embedding the glue film into the hole is lower than the surface height of the glue stripping plate, the sliding device is used for achieving relative sliding between the plastic boxand the glue stripping plate, the camera is used for shooting and identifying the device, the plastic box takes the glue stripping plate as a bottom plate, and the glue stripping plate relatively slides in a way close attachment to the plastic box along the sliding device to form the glue film on a surface of the regional bottom plate. By the glue dipping alignment device, the processing and application cost can be reduced, the technological processing time is shortened, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a device dipping glue alignment device. Background technique [0002] With the continuous development of modern information technology, integrated circuit chips are increasingly developing in the direction of high density and high performance. In order to meet the packaging requirements of integrated circuit chips, advanced packaging technologies such as 2.5D and 3D packaging have emerged. [0003] The advanced packaging technology in the prior art often needs to apply flux on one side of the chip to be packaged, and then fix the chip to be packaged on the substrate with a die bonder or flip-chip machine. The thickness of the chip to be packaged ranges from tens of microns to hundreds of microns, the diameter of the solder ball on the chip surface ranges from tens of microns to hundreds of microns, and the thickness of the adhesive film formed by flux coat...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/68
CPCH01L21/67126H01L21/68
Inventor 郝术壮李向东成冰峰
Owner 唐人制造嘉善有限公司
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