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Apparatus and method for processing a substrate

A substrate processing device and substrate technology, applied in the field of liquid devices, can solve problems such as inability to dry substrates uniformly, pattern collapse, etc.

Active Publication Date: 2022-05-03
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, when the line width of the pattern is narrowed below 30nm, as figure 1 As shown, in the process of drying the rinse solution, the pattern collapse phenomenon of pattern collapse often occurs
In addition, different areas of the substrate are rotated at different speeds, so these areas of the substrate cannot be dried uniformly

Method used

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  • Apparatus and method for processing a substrate
  • Apparatus and method for processing a substrate
  • Apparatus and method for processing a substrate

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Embodiment Construction

[0036] Hereinafter, exemplary embodiments of the present inventive concept will be described in more detail with reference to the accompanying drawings. The embodiments of the inventive concept may be modified in various forms, and the scope of the inventive concept should not be construed as being limited to the following embodiments. Embodiments of the inventive concept are provided to more fully describe the inventive concept to those skilled in the art. Therefore, the shapes of components of the drawings are exaggerated to emphasize clearer description thereof.

[0037] The system of the present embodiment of the inventive concept may be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the system of this embodiment can be connected to an exposure device to perform a developing process on a substrate. However, the present embodiment is not limited thereto, and various applications can be ...

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Abstract

Embodiments of the inventive concept relate to an apparatus and method for removing liquid remaining on a substrate. The substrate processing apparatus includes: a substrate supporting unit configured to support a substrate; a liquid supply unit configured to supply liquid onto a substrate supported by the substrate supporting unit; and a heating unit configured to heat the substrate supported by the substrate supporting unit , wherein the substrate supporting unit includes: a supporting plate having a placing surface for placing the substrate, and having an adsorption hole on the placing surface; a rotating shaft configured to rotate the supporting plate; and a vacuum member configured to reduce the adsorption The pressure of the hole causes the substrate placed on the placement surface to be vacuum-adsorbed to the support plate. Therefore, the drying efficiency of the substrate can be improved.

Description

technical field [0001] Embodiments of the inventive concept relate to an apparatus and method for liquid processing a substrate, and more particularly, to an apparatus and method for removing liquid remaining on a substrate. Background technique [0002] Processes for manufacturing semiconductor devices and flat display panels include various processes such as photolithography processes, etching processes, ashing processes, thin film deposition processes, and cleaning processes. In these processes, in a photolithography process, coating, exposure, and development steps are sequentially performed. The coating process is a process of coating a photosensitive liquid such as a resist on the surface of a substrate. The exposure process is a process of exposing a circuit pattern on a substrate on which a photosensitive film is formed. The developing process is a process of selectively developing exposed regions of the substrate. [0003] Generally, a developing process includes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67034H01L21/67103B08B3/024B08B11/02H01L21/6715H01L21/67028H01L21/67178H01L21/6838H01L21/68785B08B2203/0229H01L21/67051H01L21/6875G03F7/3057G03F7/32H01L21/02052H01L21/02307H01L21/02343H01L21/324H01L21/67098H01L21/6835H01L21/68764B05B9/002B05C11/1042B08B3/08B08B3/10C11D11/0047H01L21/6719
Inventor 郑煐宪朴昶昱
Owner SEMES CO LTD