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Detection device and method

A detection device and signal processing device technology, applied in abrasive surface adjustment devices, grinding machine parts, metal processing equipment, etc., can solve problems affecting wafer polishing quality, excessive or insufficient polishing pad wear, and affecting production efficiency.

Inactive Publication Date: 2018-05-18
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Judging the method of replacing the polishing pad based on process experience will actually cause excessive or insufficient wear of the polishing pad. Excessive wear of the polishing pad will affect the quality of wafer polishing, and insufficient use of the polishing pad will cause waste of resources.
However, the method of manually changing the polishing pad by off-line measurement will affect the production efficiency due to the need to measure the thickness of the polishing pad off-line.

Method used

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Examples

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no. 1 example

[0031] In view of this, after a long period of research and a large number of experiments, the inventor proposed a detection device 10A that solves the above-mentioned defects. Please refer to figure 1 , The detection device 10A includes: a power source 14, a ranging sensor 11, a controller 12, and a communication module 13.

[0032] Wherein, it should be noted that the detection device 10A is applied to a chemical mechanical planarization equipment, which includes: a dresser, a polishing disc, and a polishing pad arranged on the polishing disc, An emery wheel is arranged on the execution end, so that the emery wheel can move up and down and reciprocate with the main body of the execution end. During the polishing process, the dresser is moved to the top of the polishing disc, the emery wheel is pressed down to the polishing pad by pressure, and the polishing pad is reciprocated on the polishing pad to dress the polishing pad , So that the surface of the polishing pad is flat. I...

no. 2 example

[0041] See figure 2 Compared with the first embodiment, the detection device 10B provided in this embodiment is different in that the detection device 10B further includes an alarm module 15, a display module 16 and a signal processing device 17. Wherein, the power supply 14 is also connected to the alarm module 15, the display module 16 and the signal processing device 17 respectively to supply power to them so that they can work normally.

[0042] The alarm module 15 is connected to the controller 12, and is used to give an alarm prompt according to the control instruction sent by the controller 12. For example, the controller 12 compares the first thickness with a preset thickness value, When a thickness is less than or equal to the preset thickness value, the controller 12 is also used to control the alarm module 15 to issue an alarm prompt. Wherein, the prompt mode can be a sound prompt, a flashing signal lamp, or a combination of the two. In this embodiment, the alarm mod...

no. 3 example

[0049] See Figure 4 , The embodiment of the present invention also provides a detection method applied to the controller of the detection device provided in any of the above embodiments, and the following will combine Figure 4 Explain the steps involved.

[0050] Step S101: Receive distance information between the dresser and the diamond wheel detected by the distance measuring sensor.

[0051] The controller receives distance information between the dresser and the emery wheel detected by the distance measuring sensor.

[0052] Step S102: processing the distance information to obtain the first thickness of the polishing pad.

[0053] After obtaining the distance information detected by the distance measuring sensor, the controller processes the distance information to obtain the first thickness of the polishing pad.

[0054] Step S103: Compare the first thickness with a preset thickness value to obtain a comparison result.

[0055] After obtaining the first thickness, the controller...

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Abstract

The invention relates to a detection device and method, and belongs to the technical field of chemical mechanical polishing. The detection device is applied to chemical mechanical planarization equipment. The chemical mechanical planarization equipment comprises a trimmer, a polishing disk and a polishing pad arranged on the polishing disk, and a carborundum wheel is arranged on the execution endof the trimmer. The detection device comprises a power supply, a distance measuring sensor, a controller and a communication module. The distance between the trimmer and the carborundum wheel is detected through the distance measuring sensor arranged on the side, close to the polishing pad, of the trimmer; and then the distance information detected by the distance measuring sensor is processed through the controller to obtain the first thickness of the polishing pad, the first thickness and the preset thickness value are compared, so that whether the polishing pad needs to be replaced or not can be known accurately, the defects of a traditional judgment method are overcome, and the quality of wafer polishing is improved.

Description

Technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and specifically relates to a detection device and method. Background technique [0002] Chemical Mechanical Planarization (CMP) is a global planarization technology. As a consumable in the CMP process, the polishing pad needs to be replaced when it is worn to a certain degree. Usually, the replacement of polishing pad is judged by the method of estimating its wear degree according to process experience or manual offline measurement. Judging the method of replacing the polishing pad based on process experience will actually cause the polishing pad to be over- or under-weared. Excessive wear of the polishing pad will affect the quality of wafer polishing, and insufficient use of the polishing pad will result in waste of resources. However, the method of replacing the polishing pad with manual offline measurement will affect the production efficiency due to the need to perform of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B49/10B24B53/017
CPCB24B49/10B24B53/017
Inventor 张为强姜家宏李嘉浪王东辉李伟
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC