Backlight FPC board and backlight half-finished product

A backlight and backside technology, applied in the direction of electrically connecting printed components, non-printed electrical components connected printed circuits, printed circuit components, etc., can solve the problems of poor LED collinearity, LED lamp eyes, etc. Effect

Pending Publication Date: 2018-05-18
JIANGXI HOLITECH TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This makes the circuit need to be between adjacent pads, so that the FPC light bar is likely to be easily stacked due to excessive solder paste during the SMT placement process, which may easily cause the LED to be raised and the backlight to have a lamp eye problem, and the LED collinearity is poor. The problem

Method used

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  • Backlight FPC board and backlight half-finished product
  • Backlight FPC board and backlight half-finished product
  • Backlight FPC board and backlight half-finished product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] refer to figure 2 , is a schematic diagram of the back structure of the circuit layer of the backlight FPC board; combined image 3 , is a schematic diagram of the front structure of the circuit layer of the backlight FPC board; and Figure 4 and Figure 5 , the structural diagram of the backlight semi-finished product formed by adding LED components and light guide plates to the backlight FPC board.

[0024] like Figure 2 to Figure 5 As shown in , the backlight FPC board provided by the present invention includes an FPC board 1, and a plurality of groups of pads 2 arrayed on the back of the FPC board 1 along the length direction of the FPC board 1, wherein the pads 2 are connected to each other through a skip wiring process. Joined together, each group of pads 2 includes electrically connected A pole (i.e. anode, positive pole) and K pole (ie kathode, negative pole), and the skip wiring process is that the K pole of each pad 2 crosses the adjacent The pad 2 is co...

Embodiment 2

[0028] combine Figure 4 and Figure 5 , is a schematic diagram of the structure of the backlight semi-finished product formed by adding LED components and light guide plates to the backlight FPC board. The present invention also provides a backlight semi-finished product, including a light guide plate 6, an LED assembly 5 and the above-mentioned backlight FPC board 1, wherein the backlight FPC board 1 is horizontally connected to the lower end of the light guide plate 6, and the LED assembly 5 is pasted by an SMT patch process. It fits on the back of the backlight FPC board 1, and the solder paste is coated between the LED assembly 5 and the backlight FPC board 1. And the effect produced is the same as that achieved in the above-mentioned embodiment. Further, the front side of the backlight FPC board 1 is coated with white oil to form a white film layer.

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Abstract

The invention discloses a backlight FPC board which includes an FPC board and multiple groups of pads arranged in an array along the length direction of the FPC board. The pads are bonded together through a jump wiring process. Each group of pads includes a pole A and a pole K. The jump wiring process is that the K pole of each pad jumps across an adjacent pad and is connected with the pole A of the next pad through a printed line. The invention further presents a backlight half-finished product which includes a light guide plate, an LED component and a backlight FPC board. The backlight FPC board is connected horizontally to the lower end of the light guide plate. The LED component is adhered to the back of the backlight FPC board through SMT. Solder paste is applied between the LED component and the backlight FPC board. The technical scheme can avoid the flash of backlight caused by the elevation of the LED component due to the fact that the lines absorb the solder paste. The loss ofbacklight brightness is reduced because of the high co-linearity, low line resistance and low current loss of LEDs. The thickness of the FPC board can be effectively controlled. The light effect andoptical brightness of the product can reach the best state.

Description

technical field [0001] The invention relates to the technical field of backlight products and semi-finished products, in particular to a backlight FPC board and a backlight semi-finished product. Background technique [0002] With the development of science and technology, liquid crystal displays have been widely used in various electronic devices that need to be displayed. Since the liquid crystal material itself does not have self-luminous special effects, it is necessary to use a special backlight module to provide the liquid crystal display panel with light for displaying images. Backlight. The backlight module usually includes a light source, such as a light guide plate, which is used to scatter the light emitted by the light source to provide uniform surface-emitted light. [0003] refer to figure 1 , which is a schematic diagram of the solder pads and wiring structure on the FPC board of the backlight in the prior art, and the electrical connection lines 3 between t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/18
CPCH05K1/118H05K1/181H05K2201/10106
Inventor 郭攀
Owner JIANGXI HOLITECH TECH
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