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Verify placement content by comparing 3d height profile to reference height profile

A high profile and content technology, applied in the direction of measuring devices, optical devices, instruments, etc., can solve the problems of large additional costs, reducing the placement efficiency of automatic assembly machines, and being expensive

Active Publication Date: 2021-06-04
ASM ASSEMBLY SYST GMBH & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But in order to complete such a process, a special hardware must be used. On the one hand, this hardware is relatively expensive, and on the other hand, it will also occupy a larger position (in the automatic assembly machine), such as the common special hardware used in the automatic assembly machine. 3D inspection head, which replaces the placement head and is installed on the movable part of the portal system (Portalsystem)
But this solution will bring great additional costs, and because the entire gantry system is occupied, this gantry system that no longer has a placement head will also greatly reduce the placement efficiency of the corresponding automatic assembly machine

Method used

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  • Verify placement content by comparing 3d height profile to reference height profile
  • Verify placement content by comparing 3d height profile to reference height profile
  • Verify placement content by comparing 3d height profile to reference height profile

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Embodiment Construction

[0142] It should be pointed out that in the following detailed description, if the features or components of different implementation forms are the same as or at least have the same function as those of other implementation forms, these features or components are marked with the same numerals or symbols, or these symbols Only the first digit at the beginning is distinguished. To avoid unnecessary repetition, features or components that have been described in detail in one implementation form will not be described in detail when they appear repeatedly.

[0143] In addition, it should be pointed out that the implementation forms described in detail below are only a few limited examples of all possible implementation forms of the present invention. In particular, it is possible that the features of individual implementation forms can be combined with each other in an appropriate manner. Therefore, for professionals, the implementation forms described in detail in the present inve...

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Abstract

The present invention is a process of detecting the placement content (191) of an electronic component (190) of a component assembly (592,692) mounted at least partially on a circuit board (180,880), said process comprising: (a) setting a slave Refer to the reference three-dimensional height profile (763b) of the reference content of the electronic component of the reference component assembly; (b) detect the three-dimensional reference height profile (761b) of the mounted content (191) component; (c) detect the resulting height profile (761b ) is compared with the reference height profile (763b), and if (d1) at least a portion of the height profile (761b) deviates from the corresponding portion of the reference height profile (763b), the placement content (191) is identified as a missing placement content ; If (d2) the height profile (761b) matches the reference height profile (763b), then identify the mounted content (191) as the correct mounted content. In addition, the present invention also describes a process of manufacturing an electronic component assembly and an automatic assembly machine capable of performing the above process.

Description

technical field [0001] The invention relates to the general technical field of mechanically mounting circuit boards and electronic components. In particular, the present invention relates to a computer program and process for electronic component inspection, which are used to inspect the mounting content of electronic components for at least partly mounted component components on a circuit board, a process for manufacturing electronic component components and a complete Automatic assembly machine for this process. Background technique [0002] Making electronic component assemblies includes mounting electronic components on component mounting boards, especially circuit boards. Generally speaking, the placement process is done by means of an automatic assembly machine. A typical automatic assembly machine has (a) a base; (b) a component input system mounted directly or indirectly on the base for continuously delivering electronic components to be placed to the component pic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/08
CPCH05K13/08G01B11/06H05K13/0815
Inventor 特雷贝尔·马可
Owner ASM ASSEMBLY SYST GMBH & CO