Bonding device and control method of bonding device
A technology of bonding and control, which is applied in the directions of transportation and packaging, sending objects, thin material processing, etc., which can solve the problems that the adhesive cannot be discharged from the discharge port, and the adhesive is insufficient.
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[0034] Embodiments of the present invention will be described. The following description uses left and right, front and rear, and up and down indicated by arrows in the drawings. The bonding apparatus 1 is capable of bonding two objects to be bonded using the adhesive Z. The objects to be bonded are flexible sheets, for example, the lower cloth C1 and the upper cloth C2.
[0035] refer to Figure 1 to Figure 11 , the mechanical structure of the bonding apparatus 1 will be described. Such as Figure 1 ~ Figure 3 As shown, the bonding device 1 has a base part 2 , a pillar part 3 , an arm part 4 and a head part 5 . The base part 2 is in the shape of a cuboid, and is fixed on the workbench. The pillar part 3 has a columnar shape and extends upward from the upper surface of the base part 2 . The arm portion 4 extends leftward from the upper end portion of the pillar portion 3 . The head portion 5 protrudes leftward from the left end portion of the arm portion 4 . The stand ...
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