a power supply

Abstract

An embodiment of the present invention provides a power supply device, the power conversion unit group includes a first unit and at least one second unit, the second unit includes a second connector and a second device unit, and the second device unit is connected through the second The component is electrically connected to the substrate on the first unit, and after the connection, there is a space between the second device unit and the substrate, and the first device unit can also be set on the substrate where the space is located; by setting the second unit The overhead setting of the power supply device is realized, and the problem that it is difficult to realize high-density layout setting due to the limitation of the actual area of ​​the circuit board when laying out the power supply device in a tiled manner is solved. At the same time, it also improves the power density of the vertical package, solves the problem of product welding process, and achieves the purpose of miniaturization and high reliability.

Description

technical field [0001] The invention relates to the technical field of power supplies, in particular to a power supply device. Background technique [0002] With the increasing power and decreasing volume of equipment in the communication field, the requirements for the power density and conversion efficiency of the power supply are getting higher and higher, and the degree of heat dissipation at the power supply point will directly affect the conversion efficiency of the power supply. [0003] The existing power supply mainly consists of power conversion unit, components, electrical connection unit and other components. In addition, the package of the power supply is also one of the effective ways to realize the heat dissipation of the power supply. The package mainly has two structures: plug-in package and patch package. Type SMD packaging can reduce the occupied area of ​​components and improve the layout density of system products. At present, in the application field o...

AI Technical Summary

Problems solved by technology

At present, in the application field of power supply, there are vertical applications, but there is no good solution for the heat dissipation of vertical packaging; for the electrical connection layout of components in a tiled way, the heat dissipation can be better However, due to the limited area of ​​each power supply circuit board, it is impossible to achieve a relatively dense layout of components and components, which limits the setting of components and components. Therefore, it also limits the design of higher-precision power supply devices.

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