Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A three-dimensional scanning system and method

A technology of three-dimensional scanning and scanning points, applied in the field of optical scanning, can solve the problems of increasing the workload of scanning and measuring, spending a lot of time, and cumbersome process of pasting reflective marking points.

Active Publication Date: 2022-05-13
ZG TECH CO LTD
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] 3D laser scanners have been able to conveniently solve most of the high-precision measurement tasks that do not require the surface texture of objects, but they must paste a certain number of evenly distributed reflective marker points on the surface of the object to be measured for frame splicing during scanning, while pasting reflective The process of marking points is cumbersome and takes a lot of time, which increases the workload of scanning and measurement, and is not suitable for high-value items such as high-precision equipment and cultural relics that do not allow marking points to be pasted on the surface
However, due to its algorithm mechanism, the accuracy cannot meet the needs of precise measurement

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A three-dimensional scanning system and method
  • A three-dimensional scanning system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0069] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0070] Such as figure 1 As shown, a three-dimensional scanning system includes a tracking device 1, a scanner 2 and a processor 4, and the surface of the scanner 2 is provided with at least four reference marker points;

[0071] The tracking device 1 is used to obtain the coordinates of the reference marker points in the first coordinate system (X Tj ,Y Tj ,Z Tj )(j=1,2,3...n, and n≥4);

[0072] The scanner 2 is used to scan the target object 3, and obtain the coordinates (X Sk ,Y Sk ,Z Sk )(k=1,2,3...m);

[0073] The processor 4 is used to obtain the coordinates (X) of the reference marker point in the second coordinate system Si ,Y Si ,Z Si ) (i=1,2,3...n, and n≥4), and according to the coordinates of th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a three-dimensional scanning system and method. The system includes a tracking device, a scanner and a processor. The surface of the scanner is provided with a plurality of reference mark points; the tracking device acquires the first coordinates of the reference mark points within its field of view. The scanner scans the target object to obtain the second coordinates of the scanning point formed on the surface of the target object; the processor obtains the second coordinates of the reference mark point, and also according to the first coordinate of the reference mark point and the second The coordinates and the second coordinates of the scanning points construct the surface of the target object in the first coordinate system to generate a three-dimensional model of the target object. The present invention acquires the first coordinates of the reference reflective point and the second coordinates of the scanning point respectively, and obtains the first coordinates of the scanning point according to the first coordinates of the reference reflective point and the second coordinates of the scanning point, which can be in the first coordinate system The surface of the target object is constructed in the middle to generate a three-dimensional model of the target object. The scanning accuracy is high, convenient and fast, and the working space can be expanded.

Description

technical field [0001] The invention relates to the technical field of optical scanning, in particular to a three-dimensional scanning system and method. Background technique [0002] 3D laser scanners have been able to conveniently solve most of the high-precision measurement tasks that do not require the surface texture of objects, but they must paste a certain number of evenly distributed reflective marker points on the surface of the object to be measured for frame splicing during scanning, while pasting reflective The process of marking points is cumbersome and takes a lot of time, which increases the workload of scanning and measurement. It is also not suitable for high-value items such as high-precision equipment and cultural relics that do not allow marking points to be pasted on the surface. [0003] The white light scanner in the prior art does not need to stick marker points on the surface of the object to be measured for image positioning and posture determinatio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06T17/00
CPCG06T17/00
Inventor 郑顺义王晓南成剑华刘庆龙朱锋博
Owner ZG TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com