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New automotive igniter high voltage diode

A high-voltage diode and igniter technology, which is applied to electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problem of low reliability of high-voltage diodes of automobile igniters, and achieve the effect of solving low reliability.

Inactive Publication Date: 2019-01-18
上海艾续电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The main purpose of this application is to provide a new type of high-voltage diode for automobile igniters to solve the technical problem of low reliability of high-voltage diodes for automobile igniters in the related art

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  • New automotive igniter high voltage diode

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Embodiment Construction

[0013] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only It is an embodiment of a part of the application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0014] It should be noted that the terms "first" and "second" in the description and claims of the present application and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It should be understood that the data so used may be interchanged under appropriate circumstances for...

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Abstract

The present application discloses a novel high-voltage diode for automobile igniter. Comprises a series-connected multi-layer anti-surge GPP chip and a polyimide glue coated with the GPP chip, the outer surface of the polyimide adhesive is encapsulated by epoxy resin, the GPP chips are serially connected with each other through solder, a plurality of the GPP chips are directly connected with eachother through dry phosphor bronze leads, and the dry phosphor bronze leads are exposed to the epoxy encapsulation part to be provided with electroplating tin; As that GPP chip are directly connected through dry phosphor bronze lead, Through the special hardness and toughness of dry phosphor bronze lead wire, the purpose that the lead wire can be bent and formed without breaking is achieved, thereby realizing the technical effect of accurate forming of the diode, and further solving the technical problem of low reliability of high-voltage diode of automobile igniter in the related art.

Description

technical field [0001] The present application relates to the field of semiconductors, in particular, to a novel high-voltage diode for an automobile igniter. Background technique [0002] Most of the high-voltage diodes in the related art use the O.J chip process. Since the chip is only protected by protective rubber (silicone rubber or polyimide rubber), the electrical reliability is unstable; there is also a GPP chip process, but due to the GPP The chip glass protective layer is susceptible to stress impact and poor machining performance, which also leads to unstable reliability for customers, and cannot meet the high reliability requirements of high-voltage diodes for automotive igniters. [0003] Therefore, be badly in need of a kind of novel automobile igniter high-voltage diode, to solve the technical problem that the reliability of the automobile igniter high-voltage diode is not high in the related art. Contents of the invention [0004] The main purpose of this ...

Claims

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Application Information

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IPC IPC(8): H01L23/29H01L23/498H01L29/861
CPCH01L23/293H01L23/498H01L29/861H01L2224/33181H01L2924/181H01L2924/00012
Inventor 袁春辉王浩
Owner 上海艾续电子科技有限公司
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