Unit artificial surface plasma excimer transmission line based on spiral structure

Abstract

The invention provides a unit artificial surface plasma excimer transmission line based on a spiral structure. The transmission line structurally comprises two layers; the upper layer is a metal conducting belt; the lower layer is a substrate base sheet; the metal conduction belt is designed into a concave structure with a groove; an integral spiral structure is formed in a mode of spirally and internally winding a metal copper conductor on the top of the left side of the inner wall of the groove and also spirally winding the metal copper conductor in a complementary way on the top of the right side of the inner wall of the groove to be matched with the metal copper conductor extending out from the inner wall of the left side; and the metal copper conductors extending at the two sides do not intersect with each other. The unit artificial surface plasma excimer transmission line provided by the invention can realize the spiral winding of the metal conducting belt on each groove arm through a simple process; the preparation process is simple; the preparation cost is low; after the spiral metal conducting belt is optimized, the chromatic dispersion enhancement is realized; the constraint capability of the artificial surface plasma excimer transmission line on electromagnetic waves is improved; and the performance of artificial surface plasma excimers is improved.

Description

technical field [0001] The application relates to a unit artificial surface plasmon transmission line based on a helical structure, which belongs to the technical field of electronic devices. Background technique [0002] Artificial surface plasmon transmission line (Spoof Surface Plasmon Transmission Line, SSP-TL) is widely used in microwave circuits, such as filters, leaky wave antennas, power dividers, etc. The SSP-TL with the traditional unit structure is composed of a grooved metal conduction band and a substrate substrate, which has weak control ability to the electromagnetic field. Usually, the way to increase the dispersion and enhance the binding ability of the electromagnetic field is to increase the depth of the groove, but because the groove The depth of the groove is limited, and a substantial increase in the depth of the groove can only be achieved by increasing the height of the groove arm, which will inevitably increase the size of the SSP-TL. Contents of t...

AI Technical Summary

Problems solved by technology

The SSP-TL with the traditional unit structure is composed of a grooved metal conduction band and a substrate substrate, which has weak control ability to the electromagnetic field. Usually, the way to increase the dispersion and enhance the binding ability of the electromagnetic field is to increase the depth of the groove, but because the groove The depth of the groove is limited, and a substantial increase in the depth of the groove can only be achieved by increasing the height of the groove arm, but it is bound to increase the size of the SSP-TL

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