Enhanced boiling device

A technology that enhances boiling and evaporating chambers. It is applied in the direction of cooling/ventilation/heating transformation, heat exchange equipment, lighting and heating equipment, etc. It can solve the problems of affecting the heat exchange area, the decline of heat transfer capacity, and the difficulty of processing, so as to reduce the Heat transfer thermal resistance, increase heat flux density, reduce the effect of contact thermal resistance

Pending Publication Date: 2019-06-14
ZHUZHOU ZHIRE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The effect of machining porous surfaces is relatively good, but the number of bubble cores increased by this method is limited, and it is difficult to process pores below 0.1mm. As the heat flux increases, transitional boiling is prone to occur, resulting in a decrease in heat transfer capacity; In addition, the machining cost is high and the manufacturing cycle is long, which cannot meet the requirements of large-scale and efficient production.
[0005] The method of metal sintering can increase the number of bubble cores very well, but the pores produced by sintering will affect the thermal conductivity of the material and thus affect the effective heat exchange area; there are other substances remaining in the sintering process, which will affect the performance of the phase change medium
[0006] Laser etching and chemical etching have the disadvantages of limited etching depth, insufficient heat transfer area, and extremely prone to transitional boiling.

Method used

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Embodiment Construction

[0030] In order to better understand the purpose, structure and function of the present invention, the enhanced boiling device of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0031] Relevant terms in the present invention are explained as follows:

[0032] Boiling heat transfer: refers to the heat transfer process in which heat is transferred from the wall to the liquid to make the liquid boil and vaporize.

[0033] Vaporization Core: The vaporization core is the carrier that initiates the boiling of the liquid.

[0034] Thermal conductivity: defined as taking two parallel planes with a distance of 1 meter and an area of ​​1 square meter perpendicular to the direction of heat conduction inside the object. If the temperature difference between the two planes is 1K, it will be conducted from one plane to the other within 1 second. The heat in a plane is defined as the thermal conductivity of the substance in wa...

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Abstract

The invention discloses an enhanced boiling device. The enhanced boiling device comprises an evaporation cavity body and enhanced boiling fins, wherein the evaporation cavity body is internally provided with a cavity, and the enhanced boiling fins are arranged on the inner wall surface of the evaporation cavity body; a phase-change heat transfer medium is arranged inside the evaporation cavity body, and the heat of a heating source is absorbed by the evaporation cavity body and is transferred to the phase-change heat transfer medium through the inner wall surface; and the enhanced boiling finscan increase the number of vaporization cores on the inner wall of the evaporation cavity body and can increase the area of boiling heat transfer to promote boiling vaporization of the phase-change heat transfer medium and reduce boiling heat resistance. The enhanced boiling device has the following advantages that the enhanced boiling fins densely arranged are adopted, the heat transfer area isimproved maximumly, and the boiling heat transfer conductive heat resistance is reduced; and through holes or windows densely distributed on the enhanced boiling fins greatly increase bubble cores, the number of boiling cores is increased, bubbles are easily formed, and thus the heat transfer resistance is reduced.

Description

technical field [0001] The invention belongs to the technical field of heat exchange devices, in particular to an enhanced boiling device for electronic devices. Background technique [0002] Phase change heat dissipation is becoming more and more popular as a high-efficiency heat dissipation method. The principle of phase change heat dissipation is to use the phase change medium to boil and gasify at a certain temperature to absorb heat, and then the gas is condensed and liquefied at other locations to release heat, thereby realizing heat transfer. , good heat transfer effect and wide application. The evaporation and gasification stage is the key stage of the phase change heat transfer process, and the heat transfer efficiency directly affects the effect of the phase change heat transfer. [0003] In order to improve the heat transfer efficiency and enhance the heat transfer effect of boiling, the principle of enhancing the heat transfer effect of boiling mainly includes i...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): F28D15/02F28D15/04F28F3/02F28F9/18H05K7/20
CPCF28D15/0233F28D15/046F28F3/027
Inventor李纯胡广帆姚春红马秋成
OwnerZHUZHOU ZHIRE TECH