Modification method of glue homogenizer

A technology for a glue dispenser and a glue tray, applied in the directions of cleaning methods and utensils, chemical instruments and methods, cleaning methods using liquids, etc.

Active Publication Date: 2020-11-03
JILIN SINO MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for reforming the glue homogenizer, so as to alleviate the technical problem that the glue homogenizer in the prior art cannot meet the use requirements

Method used

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  • Modification method of glue homogenizer
  • Modification method of glue homogenizer
  • Modification method of glue homogenizer

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Embodiment Construction

[0039] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0040] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a spe...

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Abstract

The invention provides a glue homogenization machine transformation method, and relates to the technical field of semiconductor chip production. The method includes the steps of transforming an alignment positioning clamp assembly to make the alignment positioning clamp assembly matched with a to-be-processed part, transforming a back side cleaning system located under the alignment positioning clamp assembly to clean the back side of the to-be-processed part, transforming a glue disc assembly located under the back side cleaning system to collect waste liquid, and transforming a glue pipe assembly and a glue barrel assembly, wherein one end of the glue pipe assembly communicates with the glue disc assembly, and the other end of the glue pipe assembly communicates with the glue barrel assembly, so that the waste liquid in the glue disc assembly is transferred to the glue barrel assembly. An exhaust port is formed in the glue barrel assembly, communicates with the glue disc assembly through the glue pipe assembly and is used for increasing the exhaust amount in the glue disc assembly. The glue homogenization machine transformation method is provided for alleviating the technical problem that a glue homogenization machine in the prior art cannot meet use requirements.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip production, in particular to a method for reforming a glue homogenizer. Background technique [0002] The glue homogenizer is a device that drips various glue solutions on a high-speed rotating substrate, and uses centrifugal force to coat the glue dripped on the substrate evenly on the substrate. The existing gluing machine for the production of thyristor products, from the perspective of use requirements, this equipment can only be used in the 5-inch silicon wafer gluing process in the early stage of the semiconductor industry, the utilization rate is low, and there are defects, and for The new thyristor products in the semiconductor chip industry cannot meet their needs for the use of equipment. From a technical point of view, its defects are: 1. It cannot meet the needs of the gluing process of 4-inch silicon wafers with graphics on the front and back; 2. For silicon wafers with gr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C11/08B05C11/11B05C13/02B08B3/02
CPCB05C11/08B05C11/11B05C13/02B08B3/02
Inventor 王玄
Owner JILIN SINO MICROELECTRONICS CO LTD
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