The invention provides a glue homogenization 
machine transformation method, and relates to the technical field of 
semiconductor chip production. The method includes the steps of transforming an alignment positioning clamp 
assembly to make the alignment positioning clamp 
assembly matched with a to-be-processed part, transforming a back side cleaning 
system located under the alignment positioning clamp 
assembly to clean the back side of the to-be-processed part, transforming a glue 
disc assembly located under the back side cleaning 
system to collect waste liquid, and transforming a glue 
pipe assembly and a glue 
barrel assembly, wherein one end of the glue 
pipe assembly communicates with the glue 
disc assembly, and the other end of the glue 
pipe assembly communicates with the glue 
barrel assembly, so that the waste liquid in the glue 
disc assembly is transferred to the glue 
barrel assembly. An exhaust port is formed in the glue barrel assembly, communicates with the glue disc assembly through the glue pipe assembly and is used for increasing the exhaust amount in the glue disc assembly. The glue homogenization 
machine transformation method is provided for alleviating the technical problem that a glue homogenization 
machine in the prior art cannot meet use requirements.