The invention provides a glue homogenization
machine transformation method, and relates to the technical field of
semiconductor chip production. The method includes the steps of transforming an alignment positioning clamp
assembly to make the alignment positioning clamp
assembly matched with a to-be-processed part, transforming a back side cleaning
system located under the alignment positioning clamp
assembly to clean the back side of the to-be-processed part, transforming a glue
disc assembly located under the back side cleaning
system to collect waste liquid, and transforming a glue
pipe assembly and a glue
barrel assembly, wherein one end of the glue
pipe assembly communicates with the glue
disc assembly, and the other end of the glue
pipe assembly communicates with the glue
barrel assembly, so that the waste liquid in the glue
disc assembly is transferred to the glue
barrel assembly. An exhaust port is formed in the glue barrel assembly, communicates with the glue disc assembly through the glue pipe assembly and is used for increasing the exhaust amount in the glue disc assembly. The glue homogenization
machine transformation method is provided for alleviating the technical problem that a glue homogenization
machine in the prior art cannot meet use requirements.