130results about How to "Reduce the amount of wiring" patented technology

The invention relates to the display technical field and particularly relates to an AMOLED display panel and an organic light emitting display device. The display panel comprises a pixel circuit, data lines coupled to the pixel circuit, a drive chip, a multi-way selection unit and a voltage stabilization unit. The drive chip is used for providing a first data signal, the multi-way selection unit is connected between the data lines and the drive chip to transmit the first data signal to the data lines, and the voltage stabilization unit is connected between the data lines and the drive chip to output a second data signal to the data lines. The data lines receive the second data signal provided by the voltage stabilization unit before the data writing-in stage. By means of the display panel and the organic light emitting display device, the voltage stabilization unit is used, so that the multi-way selection unit can be used; the arranging number of the data lines in the display panel is reduced due to the usage of the multi-way selection unit, and accordingly, the size of the display panel is reduced, and the fabrication process difficulty is reduced.

The invention provides a sensing device based on the friction generating technology and a preparing and using method of the sensing device. A self-driven working mode in which a power source does not need to be additionally arranged and monitoring can be carried out anytime is achieved in the sensing device through the friction generating technology. The sensing device comprises two arrays. Each array is composed of a plurality of independent units which intersect with one another in an insulated mode to form a net structure. An independent sensing pixel point is arranged between every two adjacent intersections. Electrical signals of all the sensing units are independently output. By means of the net structures, the resolution ratio of the sensing device is greatly improved, the wiring number of circuit connection is reduced, and large-scale industrial application is greatly facilitated.

The invention discloses a display apparatus and fabrication method and fabrication apparatus for the same. The display apparatus includes: a pixel array section including a plurality of pixel circuits disposed in rows and columns and each including a driving transistor configured to produce driving current, a storage capacitor configured to store information in accordance with a signal amplitude of an image signal, an electro-optical element connected to an output terminal of the driving transistor, and a sampling transistor configured to write information in accordance with the signal amplitude into the storage capacitor, the driving transistor being operable to produce driving current based on the information stored in the storage capacitor and supply the driving current to the electro-optical element to cause the electro-optical element to emit light. The pixel circuit includes a pixel divided into a plurality of divisional pixels each of which independently includes the electro-optical element, the storage capacitor and the driving transistor.

The invention provides an array substrate, a drive method of the array substrate and a display device of the array substrate, and relates to the technical field of display. The array substrate, the drive method of the array substrate and the display device of the array substrate are capable of avoiding that a horizontal line is poor, and improving yield of products of the display device of the array substrate. The array substrate comprises a plurality of pixel groups which are arranged in an matrix mode, a plurality of grid lines which correspond to the pixel groups and are transversely arranged, a plurality of columns of first data lines and a plurality of columns of second data lines, wherein the first data lines and the second data lines are lengthways arranged. Each pixel group comprises a first pixel unit and a second pixel unit. The first pixel unit and the second pixel unit are arranged on two adjacent lines. A grid line is respectively connected with a first pixel unit and a second pixel unit in a corresponding pixel group. A first data line is connected with the first pixel unit of the corresponding pixel group so as to provide data signals for the first pixel unit. A second data line is connected with the second pixel unit of the corresponding pixel group so as to provide data signals for the second pixel unit. The grid lines on the periphery of pixel units are formed by the same layer of metal.

Adequate heat dissipation is essential for semiconductor devices. When a device exceeds a specified junction temperature, the device can be damaged, not perform correctly, or can have a reduced operating life. Semiconductor packages must dissipate heat from the chip to the external environment (i.e. to the PCB, air, etc) to keep the semiconductor device below a certain temperature threshold. For most devices, the most efficient way to dissipate the heat is through the package external I / O connections and into the PCB that it is mounted to. For Ball Grid Array (BGA) packages, the external I / Os are solder balls. Variable pitch packages pose advantages in heat dissipation without introducing significant costs.

A perforator is composed of a punch head for perforating on a material, a rotation driver for making said punch head to rotate, a reciprocating driver for making said punch heat to move axially, and a motor for driving said both drivers.