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Systems and methods of improved heat dissipation with variable pitch grid array packaging

A technology of spacing and packaging, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems that affect product profits, high cost, and affect device reliability

Inactive Publication Date: 2012-05-09
CONEXANT SYST INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these attempts are very costly and negatively impact product margins, plus they have been shown to impact device reliability

Method used

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  • Systems and methods of improved heat dissipation with variable pitch grid array packaging
  • Systems and methods of improved heat dissipation with variable pitch grid array packaging
  • Systems and methods of improved heat dissipation with variable pitch grid array packaging

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Embodiment Construction

[0044] Description of the implementation

[0045] A detailed description of embodiments of the invention is provided below. While the present disclosure is described in connection with these figures, there is no intention to limit it to the embodiments disclosed herein. On the contrary, the intention is to cover all other alternatives, modifications and equivalents as included within the spirit and scope of the present disclosure as defined by the appended claims.

[0046] Figure 9 shows a bottom view of a package with variable pitch I / O interfaces. The package can use any of the array technologies like BGA, PGA and / or LGA, but for the purposes of this article, the BGA example is used. Also, a package similar to that described in FIG. 1 is used as an example. However, one of ordinary skill in the art will understand the applicability of choosing array packages such as PGA and LGA and different BGA configurations such as CBGA and flip-chip BGA.

[0047] exist Figure 11 In...

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PUM

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Abstract

Adequate heat dissipation is essential for semiconductor devices. When a device exceeds a specified junction temperature, the device can be damaged, not perform correctly, or can have a reduced operating life. Semiconductor packages must dissipate heat from the chip to the external environment (i.e. to the PCB, air, etc) to keep the semiconductor device below a certain temperature threshold. For most devices, the most efficient way to dissipate the heat is through the package external I / O connections and into the PCB that it is mounted to. For Ball Grid Array (BGA) packages, the external I / Os are solder balls. Variable pitch packages pose advantages in heat dissipation without introducing significant costs.

Description

technical field [0001] The present invention relates generally to semiconductor packaging, and more particularly to the use of variable pitch interfaces. Background technique [0002] As modern integrated circuits (ICs) require more input-output (I / O) interfaces, IC packages have evolved from dual in-line pins (DIPs) where pins are only available at the pin grid array (PGA) available in lattice mode. Pins in the PGA are used to conduct electrical signals from the integrated circuit to the printed circuit board and vice versa. Instead of having long leads, the packaged ball grid array BGA replaces the leads with solder balls connected to the bottom of the package that conduct electrical signals to and from the printed circuit board PCB. A matched PCB has conductive pads in the form of matching solder balls. When the package is heated, the solder melts and couples the package to the PCB. As the package cools, the solder solidifies to complete the assembly. [0003] Especi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L23/48H01L23/488
CPCH01L2924/3011H01L2924/16152H01L24/48H01L2224/16H01L2224/48227H01L2924/14H01L2224/49109H01L23/49838H01L2224/73253H01L24/49H01L2924/15311H01L23/3677H01L24/16H01L2224/48091H01L2924/30107H01L2224/48105H01L2224/451H01L2924/00014H01L2924/181H01L2924/00H01L2224/45099H01L2224/05599H01L2924/00012
Inventor 李建军罗伯特·W·沃伦尼克·罗希
Owner CONEXANT SYST INC
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