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Semiconductor substrate processing apparatus and method

A technology for substrates and processing tools, applied in the field of processing tools of flow conductance adjustment systems, can solve problems such as changing the pressure of vacuum chambers

Inactive Publication Date: 2019-11-12
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, it is usually not possible to change the pressure of the vacuum chamber by changing the conductance of the system

Method used

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  • Semiconductor substrate processing apparatus and method
  • Semiconductor substrate processing apparatus and method
  • Semiconductor substrate processing apparatus and method

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Embodiment Construction

[0035] Apparatus according to embodiments described herein include a vacuum processing chamber having a configurable conductance. In certain embodiments, the cathode liner and flow restriction ring can be displaced relative to each other in order to provide rapid changes in conductance. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent to those skilled in the art that the embodiments may be practiced without these specific details. In other instances, well-known aspects have not been described in detail so as not to unnecessarily obscure the embodiments. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0036] As mentioned above, existing systems do not include a mechanism to quickly and stably change the pressure in the vacuum chamber. Accordingly, embodiment...

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Abstract

A semiconductor substrate processing apparatus and method are provided. Embodiments described herein include a processing tool comprising configured for rapid and stable changes in the processing pressure. In an embodiment, the processing tool may comprises a chamber body. In an embodiment, the chamber body is a vacuum chamber. The processing tool may further comprise a chuck for supporting a substrate in the chamber body. In an embodiment, the processing tool may also comprise a cathode liner surrounding the chuck and a flow confinement ring aligned with the cathode liner. In an embodiment, the cathode liner and the flow confinement ring define an opening between a main processing volume and a peripheral volume of the vacuum chamber.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Provisional Application No. 62 / 665,852, filed May 2, 2018, which is hereby incorporated by reference in its entirety. technical field [0003] Embodiments relate to the field of semiconductor processing equipment, and in particular embodiments, to processing tools with conductance adjustment systems for rapidly and stably changing chamber pressures. Background technique [0004] Processing recipes implemented by processing tools having vacuum chambers typically include pressure changes. For example, the pressure can be increased or decreased to provide desired properties (eg, plasma properties). Additionally, it may be necessary to vary the pressure of the vacuum chamber in order to insert or remove substrates from the vacuum chamber. [0005] Pressure changes, such as those described above, typically take a considerable amount of time to stabilize the vacuum chamber at a s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01J37/32
CPCH01L21/6719H01J37/32816H01J37/32568H01J37/32642H01J37/32715H01L21/68742H01L21/67276H01L21/67253H01L21/67017H01L21/6831H01L21/68721H01L21/6833H01J2237/182
Inventor A·恩古耶Y·S·维舍瓦纳斯X·常
Owner APPLIED MATERIALS INC
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