A kind of halogen-free resin composition, RCC, adhesive film and metal-clad laminate

A technology of resin composition and epoxy resin, applied in the field of RCC, adhesive film and metal foil-clad laminate, and halogen-free resin composition, can solve the problems of insufficient flexibility or flexure, and achieve excellent heat dissipation effect

Active Publication Date: 2022-05-17
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the deficiencies in the prior art, provide a halogen-free resin composition, solve the problem of insufficient flexibility or flexibility of the resin formulation under the condition of high filler thermal conductivity system, and at the same time satisfy excellent heat dissipation and insulation reliability , heat resistance, peel strength, long-term reliability

Method used

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  • A kind of halogen-free resin composition, RCC, adhesive film and metal-clad laminate
  • A kind of halogen-free resin composition, RCC, adhesive film and metal-clad laminate
  • A kind of halogen-free resin composition, RCC, adhesive film and metal-clad laminate

Examples

Experimental program
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Effect test

Embodiment 1-6 and comparative example 1-4

[0037] The specific components and component contents (in parts by weight) of the resin compositions of Examples 1-6 and Comparative Examples 1-4 are shown in Table 1. The component codes and their corresponding component names are as follows:

[0038] A. Large-equivalent isocyanate-modified epoxy resin: the epoxy equivalent is 530-650g / mol, and the viscosity (25°C) is 3300-4200mPa.s.

[0039] (A1) Epoxy equivalent 545g / mol, viscosity (25°C) 3760mPa.s isocyanate modified epoxy

[0040] (A2) Epoxy equivalent 643g / mol, viscosity (25°C) 4198mPa.s isocyanate modified epoxy

[0041] B. High molecular weight dicyclopentadiene phenol epoxy resin: viscosity (25°C) is 24000-32000mPa.s, and its molecular formula is

[0042]

[0043] Wherein, n is a positive integer of 30-50.

[0044](B1) n value is 32, viscosity (25°C) 24300mPa.s dicyclopentadiene phenol epoxy resin

[0045] (B2) n value is 41, viscosity (25°C) 27130mPa.s dicyclopentadiene phenol epoxy resin

[0046] (B3) n valu...

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Abstract

The invention provides a halogen-free resin composition, comprising a large equivalent weight isocyanate modified epoxy resin, a large molecular weight dicyclopentadiene phenol epoxy resin, a curing agent, plasticized end epoxy acrylate rubber, a curing accelerator, and thermally conductive fillers. The invention also provides RCC, laminated board, adhesive film and metal foil-clad laminated board prepared by using it. The halogen-free resin composition has excellent toughness, and the thermal conductivity of the aluminum-based copper-clad laminate made of it can reach more than 2.2W / m.k. The peel strength of the folded surface (T288°C, 10s)≥1.8N / mm, the thermal stress of the bent surface is 288°C dip soldering≥60min, after bending 360° spirally, the breakdown voltage of the bent surface after heat treatment is ≥7kV, at Cycle treatment 1000 times under certain conditions, breakdown voltage ≥ 6kV.

Description

technical field [0001] The invention belongs to the technical field of metal foil-clad laminates, and in particular relates to a halogen-free resin composition, RCC, adhesive film and metal foil-clad laminates. Background technique [0002] LED is more and more applied to landscape lighting, architectural lighting, indoor lighting, and stage lighting due to its advantages of environmental protection, low energy consumption, and long life. Conventional LED substrates are planar. With the development of the lighting industry, LED lighting tends to develop in a 3D direction. [0003] Compared with conventional LED lighting, 3D-LED lighting requires the base aluminum substrate to have excellent toughness and flexibility under the conditions of ensuring excellent heat dissipation, heat resistance, insulation, and peel strength, so as to meet the needs of the board during PCB processing and bending. There is no breakage or delamination of the insulation layer. [0004] In order ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/08C08L63/10C08K3/22C08K7/18C08J5/18B32B7/06B32B15/04B32B15/20B32B33/00
CPCC08L63/00C08J5/18B32B15/20B32B15/04B32B7/06B32B15/043B32B33/00B32B2255/26B32B2255/06C08L2205/03C08L2203/20C08L2201/08C08L2201/22C08K2003/2227C08K2201/003C08J2363/00C08J2463/08C08J2463/10C08L63/08C08L63/10C08K3/22C08K7/18
Inventor 王波李莎郑浩武伟
Owner SHAANXI SHENGYI TECH
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