Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Top gate type oxide array substrate and preparation method thereof

A technology of array substrates and oxides, applied in semiconductor/solid-state device manufacturing, electrical components, transistors, etc.

Pending Publication Date: 2020-03-31
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a top-gate oxide array substrate and a preparation method thereof, so as to alleviate the defects in the existing preparation process of the top-gate oxide array substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Top gate type oxide array substrate and preparation method thereof
  • Top gate type oxide array substrate and preparation method thereof
  • Top gate type oxide array substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] The technical solutions in the embodiments and / or examples of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention. Obviously, the embodiments and / or examples described below are only part of the implementation of the present invention. schemes and / or examples, rather than all implementations and / or examples. Based on the implementations and / or examples in the present invention, all other implementations and / or examples obtained by persons of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0048] The directional terms mentioned in the present invention, such as [top], [bottom], [left], [right], [front], [back], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the pre...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a top gate type oxide array substrate and a preparation method thereof. The top gate type oxide array substrate comprises a substrate, a shading layer, a buffer layer, an activelayer, an etching barrier layer, a gate insulating layer, a gate layer, an interlayer insulating layer, a source and drain layer, a passivation layer and a pixel electrode layer which are stacked insequence, according to the preparation method, a silicon oxide film layer of which the film quality is close to that of a gate insulating layer is prepared on an active layer to serve as an etching barrier layer, patterning processing is carried out on the etching barrier layer and the active layer together, then the etching barrier layer is etched along with the gate insulating layer, and a parton a channel region of the active layer is reserved; by means of the protection of the etching barrier layer, the active layer is prevented from being eroded or damaged by chemicals in the yellow light and photoresist stripping process, the interface characteristic of the oxide active layer and the gate insulating layer is improved, and then the performance of the top gate type oxide array substrate is improved.

Description

technical field [0001] The present application relates to the technical field of mobile communication, in particular to a top-gate oxide array substrate and a preparation method thereof. Background technique [0002] The top-gate oxide thin film transistor is widely used in array substrates because of its small parasitic capacitance, fewer photomask manufacturing processes, and the gate layer and gate insulating layer can protect the channel region of the active layer. [0003] The performance of the top-gate oxide array substrate depends heavily on the interface properties between the oxide active layer and the gate insulating layer. However, during the manufacturing process of the top-gate oxide array substrate, the photoresist stripper will erode the oxide active layer, resulting in an increase in the surface roughness of the oxide active layer; meanwhile, the photoresist yellowing and the stripping process also It will increase the oxygen vacancy defect state of the oxi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/34H01L21/84H01L27/12H01L29/786
CPCH01L27/1262H01L27/1218H01L29/66969H01L29/78606H01L29/78633H01L29/7869
Inventor 罗传宝
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products