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Pixel structure, display panel and display device

A pixel structure and display panel technology, applied in static indicators, instruments, semiconductor devices, etc., can solve the problems of increasing module thickness, increasing process cost, reducing the number of ICs used, and achieving the effect of solving the problem of arrangement structure

Active Publication Date: 2021-11-02
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the Mini LED display architecture, the row and column tube channels are connected to the positive and negative electrodes of the LED. The row tubes are multiplexed through mux to reduce the number of ICs used, and the sub-pixels are lit by timing control of the row tube on and off and the column tube output. Usually Under this architecture, one or more PCB boards are required to place the driver IC, and the display panel has to pull out the positive and negative poles of all LEDs to the PCB, which makes the glass side lead process more demanding, which increases the process cost and increases the mold cost. group thickness

Method used

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  • Pixel structure, display panel and display device
  • Pixel structure, display panel and display device
  • Pixel structure, display panel and display device

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Embodiment Construction

[0037] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0038] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present invention belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Comprising" or "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other el...

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PUM

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Abstract

The application discloses a pixel structure, a display panel and a display device. The pixel structure includes three sub-pixel units of different colors and a driving unit. The three sub-pixel units include a first sub-pixel unit, a second sub-pixel unit, and a third sub-pixel unit. The driving unit sends corresponding display signals to each sub-pixel unit. Data; each sub-pixel unit is arranged on one side or both sides of the drive unit. According to the technical solutions provided by the embodiments of the present application, by arranging the sub-pixel units on one side or both sides of the driving unit, the problem of the arrangement structure of the sub-pixel units and the driving unit under the hybrid driving architecture can be solved.

Description

technical field [0001] The present disclosure generally relates to the field of display technology, and in particular, relates to a pixel structure, a display panel, and a display device. Background technique [0002] With the development of Mini LED, in addition to using 4-in-1 packaged LEDs in Mini LED display products, monochromatic RGB LEDs are also used for sub-pixel arrangement, and the sub-pixel arrangement is relatively simple. Under the Mini LED display architecture, the row and column tube channels are connected to the positive and negative electrodes of the LED. The row tubes are multiplexed through mux to reduce the number of ICs used, and the sub-pixels are lit by timing control of the row tube on and off and the column tube output. Usually Under this architecture, one or more PCB boards are required to place the driver IC, and the display panel has to pull out the positive and negative electrodes of all LEDs to the PCB, which makes the glass side lead process m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09G3/32
CPCG09G3/32H01L25/167G09G2300/0452G09G3/2003
Inventor 谷其兵胡国锋王秀荣薛静时凌云陈明
Owner BOE TECH GRP CO LTD
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