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Test device and method for high-speed link system

A high-speed link and testing device technology, applied in the field of communications, can solve the problems of low insertion loss and crosstalk testing accuracy, and achieve the effects of improving insertion loss and crosstalk testing efficiency, improving insertion loss and crosstalk testing accuracy, and simplifying insertion loss and crosstalk testing steps.

Active Publication Date: 2022-07-19
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention proposes a test device and method for a high-speed link system, which is used to solve the problem of low accuracy in the insertion loss and crosstalk test of high-speed transmission signals in the prior art

Method used

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  • Test device and method for high-speed link system
  • Test device and method for high-speed link system
  • Test device and method for high-speed link system

Examples

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Comparison scheme
Effect test

no. 1 example

[0050] The first embodiment of the present invention is a test device for a high-speed link system, such as figure 1 shown, including the following components:

[0051] A chip testing device 100, a transmission ISI (Insertion, insertion loss) attenuation testing unit 200, a crosstalk ISI attenuation device 300, and an XTK (crosstalk, crosstalk) testing unit 400;

[0052]The chip testing device 100 is configured to transmit the generated transmission test signal to the transmission ISI attenuation device 200, and transmit the generated crosstalk test signal to the crosstalk ISI attenuation device 300;

[0053] The transmission ISI attenuation device 200 is used to attenuate the received transmission test signal, and transmit the attenuated transmission test signal to the XTK test device 400;

[0054] The crosstalk ISI attenuation device 300 is used to attenuate the received crosstalk test signal, and transmit the attenuated crosstalk test signal to the XTK test device 400;

...

no. 2 example

[0063] The second embodiment of the present invention is a test device for a high-speed link system, such as figure 2 shown, including the following components:

[0064] The chip test device 100, the transmission ISI attenuation device 200, the crosstalk ISI attenuation device 300 and the XTK test device 400;

[0065] The chip testing device 100 is configured to transmit the generated transmission test signal to the transmission ISI attenuation device 200, and transmit the generated crosstalk test signal to the crosstalk ISI attenuation device 300;

[0066] The transmission ISI attenuation device 200 is used for performing insertion loss gradient scanning on the received transmission test signal, so as to attenuate the transmission test signal through different insertion loss gradient channels, and transmit the attenuated transmission test signal to the XTK test device 400 ;

[0067] The crosstalk ISI attenuation device 300 is used to perform insertion loss gradient scannin...

no. 3 example

[0122] The third embodiment of the present invention is a test method for a high-speed link system, such as image 3 As shown, the test method includes the following steps:

[0123] Step S301, according to preset test parameters, attenuate the transmission test signal and the crosstalk test signal respectively.

[0124] The test parameters include: attenuation parameters of the transmission test signal and attenuation parameters of the crosstalk test signal.

[0125] In this embodiment, the attenuation parameter of the transmission test signal is not specifically limited. It may be to attenuate the transmission test signal to a set value, or to attenuate the transmission test signal to a set attenuation amplitude value, or it may be to attenuate the transmission test signal to a set value. The value of the attenuation amplitude for the gradient attenuation of the signal.

[0126] In this embodiment, the attenuation parameter of the crosstalk test signal is not specifically l...

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Abstract

The present invention provides a test device for a high-speed link system, comprising: a chip test device, a transmission insertion loss ISI attenuation device, a crosstalk ISI attenuation device, and a crosstalk XTK test device; the XTK test device is used to measure the received crosstalk The test signal forms a crosstalk signal in the received transmission test signal, and transmits the transmission test signal carrying the crosstalk signal to the chip testing device; the chip testing device is also used for transmitting the crosstalk signal carrying the crosstalk signal The quality parameters of the test signal are tested and evaluated. The invention also discloses a test method for a high-speed link system. By implementing the above scheme, the test and evaluation accuracy of the quality parameter of the transmission test signal carrying the crosstalk signal is effectively improved; the quality of the transmission test signal carrying the crosstalk signal is simplified. The parameter test and evaluation step improves the efficiency of the quality parameter test and evaluation of the transmission test signal carrying the crosstalk signal.

Description

technical field [0001] The present invention relates to the technical field of communications, and in particular, to a testing device and method for a high-speed link system. Background technique [0002] The switching capacity and processing capacity of modern communication systems are increasing, and the transmission rate of communication signals is getting higher and higher. The loss of communication signals directly affects the correct transmission of signals and affects the entire system. Designers must understand the communication signal loss conditions in order to make correct judgments and evaluations. [0003] In the prior art, a high-speed communication system is evaluated by performing a communication signal loss test in the following two ways: the first way is to measure the eye diagram of a communication signal of one rate under two different channels, and extract the amplitude parameter from the eye diagram, and then Add the absolute values ​​of the parameters...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04B17/20H04B17/309H04L27/04
CPCH04B17/20H04B17/309H04L27/04
Inventor 刘春伟
Owner ZTE CORP
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