Multifunctional packaging adhesive film and preparation method thereof

A packaging film, multi-functional technology, applied in the direction of adhesives, film/sheet adhesive, film/sheet without carrier, etc., can solve the problem that the leftovers cannot be recycled, the anti-PID performance needs to be further improved, and the yield rate is low and other problems, to achieve the effect of excellent resistance to peeling force attenuation and excellent anti-PID performance

Pending Publication Date: 2020-11-20
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The packaging adhesive film of the invention has significantly improved volume resistivity, and has long-term adhesion to glass and backplane, but its anti-PID performance needs to be further improved
However, the addition of the alkoxysilane oligomers of this invention may reduce the crosslin...

Method used

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  • Multifunctional packaging adhesive film and preparation method thereof
  • Multifunctional packaging adhesive film and preparation method thereof
  • Multifunctional packaging adhesive film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] The multifunctional packaging adhesive film of this embodiment is a single-layer packaging adhesive film. In terms of mass percentage, the multifunctional packaging adhesive film comprises the following components:

[0052]

[0053] Wherein, the structural formula of silane oligomer is:

[0054]

[0055] The preparation method of the multifunctional encapsulation film of this embodiment is as follows: After mixing the polymer and the additives according to the above ratio, extrusion and calendering at a set temperature (screw sampling 60-85°C, die area 100°C) Extruded by equipment and machined, and embossed and shaped by three rolls, a single-layer packaging film is prepared.

Embodiment 2

[0057] The multi-functional packaging adhesive film of this embodiment is a multi-layer packaging adhesive film, specifically a three-layer structure, the upper / middle / lower thickness is 1:1:1, and the upper layer and the lower layer are made of the same material.

[0058] The formula of the upper and lower layers of adhesive film is as follows:

[0059]

[0060]

[0061] Wherein, the structural formula of silane oligomer is as follows:

[0062]

[0063] Wherein, the formula of the middle layer is as follows: CH 2

[0064]

[0065] Wherein, the structural formula of silane oligomer is as follows:

[0066]

Embodiment 3

[0068] The multi-functional packaging adhesive film of this embodiment is a multi-layer packaging adhesive film, specifically a three-layer structure, with an upper / middle / lower thickness of 1:2:1, and the upper layer and the lower layer are made of the same material.

[0069] Wherein, the formula of upper layer and lower layer adhesive film is as follows:

[0070]

[0071] Wherein, the structural formula of silane oligomer is as follows:

[0072]

[0073] Among them, the formula of the middle layer is as follows:

[0074]

[0075]

[0076] Wherein, the structural formula of silane oligomer is as follows:

[0077]

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Abstract

The invention provides a multifunctional packaging adhesive film and a preparation method thereof. The multifunctional packaging adhesive film comprises, by mass, 90 to 99% of a polymer and 1 to 10% of an auxiliary agent, and the auxiliary agent comprises a silane oligomer. The prepared multifunctional packaging adhesive film has excellent peeling force attenuation resistance and PID resistance, and can meet the requirements of packaging adhesive films with different functions.

Description

technical field [0001] The invention belongs to the technical field of packaging adhesive films, and relates to a multifunctional packaging adhesive film and a preparation method thereof. Background technique [0002] Encapsulation materials play the role of bonding protection in modules. More and more cells are used in photovoltaic modules. The performance of various cells is different, and the requirements for encapsulation film are also different; for example, P-type cells require high resistance. Adhesive film with PID performance; Heterojunction cells with round ribbons need a non-slip adhesive film, CIGS cells are afraid of heat and need low-temperature lamination, etc. The requirements for the packaging film are getting higher and higher, and it is difficult for a single layer of film or a single material to meet the packaging requirements. There is an increasing demand for multi-layer adhesive films and adhesive films prepared by blending various materials. As the ...

Claims

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Application Information

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IPC IPC(8): C09J123/08C09J175/04C09J11/06C09J11/08C09J7/10C09J7/30H01L31/048H01L31/049
CPCC09J123/0853C09J123/0815C09J175/04C09J11/06C09J11/08C09J7/10C09J7/30H01L31/0481H01L31/049C09J2203/322C09J2423/04C09J2429/00C09J2475/00C08L2205/03C08K13/02C08K5/5425C08L23/0815C08L83/04Y02E10/50
Inventor 王磊韩晓航郑亚闫烁陈洪野吴小平
Owner CYBRID TECHNOLOGIES INC
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