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Crystal Coating Method

A crystal and wafer technology, applied in the field of crystal coating, can solve the problems of cumbersome crystal coating operation and so on

Active Publication Date: 2022-05-06
ZHEJIANG CRYSTAL OPTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a crystal coating method, to alleviate the existing complex technical problems of crystal coating operations

Method used

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Embodiment Construction

[0034] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] Such as Figure 1-Figure 6 As shown, the crystal coating method provided by the embodiment of the present invention includes:

[0036] S1. Along the preset cutting contour 400, use the laser 200 to incident from the upper surface of the substrate 100 to perform modified cutting inside the substrate 100 to obtain a first intermediate product.

[0037] The substrate 100 can be a rectangular sheet structure or a strip structure. The laser 200 is incident into the substrate 100 along a direction perpendicular to the ...

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Abstract

The invention provides a crystal coating method, which relates to the technical field of optical element processing. The crystal coating method includes: along the preset cutting contour, using a laser to incident from the upper surface of the substrate to perform modification and cutting inside the substrate to obtain the first An intermediate product; coating the upper surface and / or lower surface of the first intermediate product to obtain a second intermediate product; performing a scribing operation on the upper surface of the second intermediate product with a laser along a preset cutting contour, and cutting the wafer Fragmentation is performed to separate target product from offcuts. Because the target product in the first intermediate product is not separated from the leftover material, the circumferential side of the target product will not be polluted during coating, and the circumferential side does not need to be treated with protective glue, let alone degumming treatment, which simplifies processing steps.

Description

technical field [0001] The invention relates to the technical field of optical element processing, in particular to a crystal coating method. Background technique [0002] With the rapid development of the electronics industry, the requirements for the processing precision and surface quality of precision optical components are getting higher and higher. The performance integration requirements of optical prisms promote the shape of prisms to polygonal and irregular shapes. Therefore, it breaks through the traditional Processing technology, more ingenious design of processing flow is very important. [0003] The existing crystal coating method includes: dividing a large crystal into equal-area medium crystals, then stacking a plurality of medium crystals, and bonding two adjacent medium crystals with glue; Divide into multiple groups of stacked small crystals of equal area again; take one stack of small crystals, and polish the peripheral sides of the multiple small crystal...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/402G02B1/02G02B1/10
CPCB23K26/38B23K26/402G02B1/02G02B1/10
Inventor 丁伟尹群张峰余辉刘风雷
Owner ZHEJIANG CRYSTAL OPTECH