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Crystal coating method

A crystal and wafer technology, applied in the field of crystal coating, can solve the problems of cumbersome crystal coating operations and achieve the effect of simplifying the processing steps

Active Publication Date: 2020-12-11
ZHEJIANG CRYSTAL OPTECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a crystal coating method, to alleviate the existing complex technical problems of crystal coating operations

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Embodiment Construction

[0034] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] Such as Figure 1-Figure 6 As shown, the crystal coating method provided by the embodiment of the present invention includes:

[0036] S1. Along the preset cutting contour 400, use the laser 200 to incident from the upper surface of the substrate 100 to perform modified cutting inside the substrate 100 to obtain a first intermediate product.

[0037] The substrate 100 can be a rectangular sheet structure or a strip structure. The laser 200 is incident into the substrate 100 along a direction perpendicular to the ...

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Abstract

The invention provides a crystal coating method, and relates to the technical field of optical element machining. The crystal coating method comprises the steps that a laser is incident into a substrate from the upper surface of the substrate along a preset cutting profile for modification cutting, and a first intermediate product is obtained; the upper surface and / or the lower surface of the first intermediate product are / is coated to obtain a second intermediate product; and dicing operation is carried out on the upper surface of the second intermediate product by utilizing the laser along the preset cutting profile, and splitting treatment is carried out on a wafer, so as to separate a target product from a leftover material. Due to the fact that the target product in the first intermediate product is not separated from the leftover material, during film coating, the circumferential side face of the target product cannot be polluted, protective glue treatment is not needed for the circumferential side face, glue removal treatment is not needed, and the machining steps are simplified.

Description

technical field [0001] The invention relates to the technical field of optical element processing, in particular to a crystal coating method. Background technique [0002] With the rapid development of the electronics industry, the requirements for the processing precision and surface quality of precision optical components are getting higher and higher. The performance integration requirements of optical prisms promote the shape of prisms to polygonal and irregular shapes. Therefore, it breaks through the traditional Processing technology, more ingenious design of processing flow is very important. [0003] The existing crystal coating method includes: dividing a large crystal into equal-area medium crystals, then stacking a plurality of medium crystals, and bonding two adjacent medium crystals with glue; Divide into multiple groups of stacked small crystals of equal area again; take one stack of small crystals, and polish the peripheral sides of the multiple small crystal...

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Application Information

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IPC IPC(8): B23K26/38B23K26/402G02B1/02G02B1/10
CPCB23K26/38B23K26/402G02B1/02G02B1/10
Inventor 丁伟尹群张峰余辉刘风雷
Owner ZHEJIANG CRYSTAL OPTECH