High-safety packaging method and device for storage chip
A memory chip, high-security technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as poor packaging quality of memory chips, damage to memory chips, and reduced service life of memory chips
Active Publication Date: 2021-01-12
上海威固信息技术股份有限公司
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Problems solved by technology
The packaging quality of the memory chip in the prior art is poor, which easily leads to damage of the memory chip, reduces the service life of the memory chip, and the packaging security is not high
Method used
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[0087] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0088] Refer below Figure 1 to Figure 4 A high-security packaging method and device for a memory chip proposed by an embodiment of the present invention will be described.
[0089] figure 1 It is a flow chart of a high-security packaging method for a memory chip according to an embodiment of the present invention; figure 1 As shown, including steps S1-S9:
[0090] S1. Obtain the first image information of the carrier board 11;
[0091] S2. According to the first image information, extract the position information of placing the first chip 12 on the carrier plate 11 based on the image recognition technology; the first chip 12 includes a side A and a side B, and t...
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The invention provides a high-safety packaging method and device for a storage chip. The method comprises: acquiring first image information of a bearing plate; extracting position information of a first chip placed on the bearing plate; wherein the first chip comprises a surface A and a surface B, and the surface B of the first chip comprises a groove for placing the second chip; placing the A surface of the first chip on a bearing plate according to the position information; placing a second chip in the groove; the second chip comprising a C surface and a D surface; respectively carrying outthermal stress reduction processing on the first chip and the second chip, generating a first stress dissipation layer on the B surface of the first chip, and generating a second stress dissipation layer on the D surface of the second chip; arranging a heat conduction plate on the first stress dissipation layer and the second stress dissipation layer; arranging a fin heat dissipation plate on theheat conduction plate; acquiring second image information of the bearing plate; and polishing the bearing plate, so that the packaging quality and safety are improved.
Description
technical field [0001] The invention relates to the technical field of chip packaging, in particular to a high-security packaging method and device for a memory chip. Background technique [0002] With the continuous development of science and technology, the integration level of memory chips continues to improve, which increases the need for packaging technology of memory chips. The packaging quality of the memory chip in the prior art is poor, which easily leads to damage of the memory chip, reduces the service life of the memory chip, and the packaging security is not high. Contents of the invention [0003] The present invention aims to solve one of the technical problems in the above-mentioned technologies at least to a certain extent. For this reason, the first object of the present invention is to propose a high-security packaging method for memory chips, so that the packaging quality and packaging security of the storage chips are high, avoiding damage to the stor...
Claims
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IPC IPC(8): H01L21/304H01L21/67
CPCH01L21/304H01L21/67253H01L21/67259
Inventor 吴佳李礼苗诗君邢培栋张旗余云
Owner 上海威固信息技术股份有限公司