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Pressing mechanism

A technology of pressing mechanism and adsorption zone, applied in the field of pressing mechanism, can solve problems such as poor consistency

Active Publication Date: 2021-02-23
SUZHOU HUAXING YUANCHUANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Based on this, it is necessary to propose a pressing mechanism to solve the problem of poor consistency between the chip and each chip and the spring contact

Method used

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Embodiment Construction

[0035] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0036] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counte...

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Abstract

The invention relates to a pressing mechanism. The pressing mechanism comprises a lifting assembly and a positioning assembly. The positioning assembly is driven by the lifting assembly to ascend anddescend, the positioning assembly comprises a vacuum adsorption plate with an adsorption surface and a flexible buffer module, and the flexible buffer module is located between the lifting assembly and the vacuum suction plate. The vacuum adsorption plate is used for adsorbing and positioning chips, the flexible buffer module has a buffer function, the parallelism in the crimping test process is ensured, the alignment consistency of the chips and spring contact pins is ensured, and the spring contact pins are prevented from being damaged.

Description

technical field [0001] The invention relates to the technical field of automation equipment, in particular to a pressing mechanism for locating and jacking workpieces. Background technique [0002] Chip programming refers to programming control programs and data into blank chips using a programming tester. Using this technology, blank chips can be programmed into chips with different functions as needed, so designers do not need to prepare many types of chips. When programming the chip, it is necessary to transport the chip to the programming tester for programming. In the traditional technology, after the chip carrying device is lifted up, the chip is pressed into contact with the spring contact pin of the programming tester. However, in the above-mentioned process, it is easy to appear that the positioning consistency between each chip and the pair of spring contacts is poor. Contents of the invention [0003] Based on this, it is necessary to propose a pressing mechan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/91
CPCB65G47/91
Inventor 冯利民蔡灿承
Owner SUZHOU HUAXING YUANCHUANG TECH CO LTD
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