A special aluminum alloy mixed microchannel liquid-cooled cold plate with high heat dissipation

A technology of aluminum alloy and channel liquid, which is applied in cooling/ventilation/heating transformation, modification through conduction heat transfer, electrical components, etc., and can solve the problems of micro-channel cold plate cooling capacity to be improved, pump power limitation, poor temperature consistency, etc. problems, to achieve the effect of improving temperature consistency, changing local flow resistance, and good temperature consistency

Active Publication Date: 2022-06-21
WEST ANHUI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the heat dissipation capacity of the micro-channel cold plate still needs to be improved, the temperature consistency is poor, and the pump power is limited.

Method used

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  • A special aluminum alloy mixed microchannel liquid-cooled cold plate with high heat dissipation
  • A special aluminum alloy mixed microchannel liquid-cooled cold plate with high heat dissipation
  • A special aluminum alloy mixed microchannel liquid-cooled cold plate with high heat dissipation

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Embodiment Construction

[0033] The technical solution of the present patent will be described in further detail below in conjunction with specific embodiments.

[0034] Embodiments of the present patent are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present patent, but should not be construed as a limitation on the present patent.

[0035] In the description of this patent, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientation or positional relationship indicated by "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the ...

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Abstract

The invention provides a special aluminum alloy mixed microchannel liquid-cooled cold plate with high heat dissipation, which belongs to the technical field of electronic heat dissipation and is used to solve the problems that the aluminum alloy liquid-cooled cold plate has low heat dissipation efficiency and does not have a confluence adjustment mechanism. It includes the upper and lower panels that are close and fixed. The upper and lower panels are fixed and connected by countersunk screws. Both the upper and lower panels are equipped with diversion grooves with the same depth. Two diversion groove networks are combined to form a working medium flow channel. The diversion groove network includes a heat dissipation groove. The liquid inlet end of the heat dissipation groove is provided with a spoiler block. There are several equidistant capillary tubes arranged between them, and several flow regulating valves are arranged on the upper panel; the channel of the present invention has many branches and short spans, uniform distribution, consistent temperature, smooth flow, small flow resistance, and high heat dissipation efficiency; The valve and the screw hole can distribute the flow, effectively change the local flow resistance, and the heat conduction column conducts heat quickly and cools down quickly.

Description

technical field [0001] The invention belongs to the technical field of electronic heat dissipation, and relates to an aluminum alloy liquid-cooled cold plate, in particular to a special aluminum alloy mixed micro-channel liquid-cooled cold plate with efficient heat dissipation. Background technique [0002] The trend of miniaturization of electronic devices continues to promote the rapid development of microelectronics technology, and heat dissipation is very important; the current heat dissipation technology mostly adopts natural air cooling or forced air cooling. However, the poor heat dissipation efficiency can no longer meet its heat dissipation needs. [0003] The micro-channel cooling technology has excellent heat dissipation performance, is convenient for high-level integration, and can quickly and efficiently remove the heat generated by the heating module. Combined with the development trend of antenna miniaturization and high assembly density, micro-channel cooling...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20254H05K7/20272H05K7/20281H05K7/2039
Inventor 吴军荣秦海波夏松王洪新沙美妤刘建树周宇张晓飞葛干
Owner WEST ANHUI UNIV
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