Pavement structure strain sensor manufacturing method and sensor

Abstract

The invention relates to a pavement structure strain sensor manufacturing method and a sensor. The method comprises the steps of: placing a resistance-type strain gauge with the two ends provided with a traction part and a conductive lead in a packaging die, filling a space between the packaging die and the resistance-type strain gauge with a packaging glue solution, and removing the packaging die after the packaging glue solution is solidified. The sensor manufactured through the method is more accurate in monitoring result.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a method for manufacturing a pavement structure strain sensor and the sensor. Background technique [0002] The statements herein merely provide background information related to the present invention and do not necessarily constitute prior art. [0003] In order to ensure the safety, integrity and durability of pavement structures and other infrastructure in long-term use, intelligent health monitoring systems are needed to monitor and evaluate the degree of stress and deformation of civil engineering structures, repair them and control the further development of damage. As the "neural unit" of the intelligent health monitoring system, the road deformation monitoring sensor mainly plays the role of sensing deformation. The most mature resistive strain gauge used for small strain deformation monitoring has a fragile structure, and it is difficult to survive in harsh civil engine...

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Problems solved by technology

The most mature resistive strain gauge for small strain deformation monitoring has a fragile structure, and it is difficult to survive in harsh civil engineering construction and service environments without packaging protection

However, the inventors found that most of the current packaging methods and materials pay too much attention to the survival rate of strain gauges, and most of them use high-strength metal structures for packaging. The problem of poor coordination of deformation, cannot guarantee the reliability of monitoring data

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