Method for manufacturing strain sensor of pavement structure and sensor

Abstract

The invention relates to a method for manufacturing a road surface structure strain sensor and the sensor. A resistive strain gauge with pulling parts and conductive leads installed at both ends is put into a package mold, and the space between the package mold and the resistive strain gauge is filled with After the encapsulation glue is solidified, the encapsulation mold is removed, and the monitoring result of the sensor manufactured by the method of the present invention is more accurate.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a method for manufacturing a pavement structure strain sensor and the sensor. Background technique [0002] The statements herein merely provide background information related to the present invention and do not necessarily constitute prior art. [0003] In order to ensure the safety, integrity and durability of pavement structures and other infrastructure in long-term use, intelligent health monitoring systems are needed to monitor and evaluate the degree of stress and deformation of civil engineering structures, repair them and control the further development of damage. As the "neural unit" of the intelligent health monitoring system, the road deformation monitoring sensor mainly plays the role of sensing deformation. The most mature resistive strain gauge used for small strain deformation monitoring has a fragile structure, and it is difficult to survive in harsh civil engine...

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Problems solved by technology

The most mature resistive strain gauge for small strain deformation monitoring has a fragile structure, and it is difficult to survive in harsh civil engineering construction and service environments without packaging protection

However, the inventors found that most of the current packaging methods and materials pay too much attention to the survival rate of strain gauges, and most of them use high-strength metal structures for packaging. The problem of poor coordination of deformation, cannot guarantee the reliability of monitoring data

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